Pages that link to "Category:Brandon C. Marin of Gilbert AZ (US)"
Jump to navigation
Jump to search
The following pages link to Category:Brandon C. Marin of Gilbert AZ (US):
View (previous 50 | next 50) (20 | 50 | 100 | 250 | 500)- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation) (← links)
- 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation) (← links)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation) (← links)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation) (← links)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240111092). PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (← links)
- Intel corporation (20240111095). HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (← links)
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (← links)
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (← links)
- Intel corporation (20240101413). SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES simplified abstract (← links)
- Intel corporation (20240113047). INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (← links)
- Intel corporation (20240113048). INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (← links)
- Intel corporation (20240113158). HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (← links)
- Intel corporation (20240105571). IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS simplified abstract (← links)
- Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (← links)
- Intel corporation (20240114627). ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (← links)
- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract (← links)
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract (← links)
- 17956757. PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (Intel Corporation) (← links)
- 17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation) (← links)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation) (← links)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation) (← links)
- 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation) (← links)
- 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation) (← links)
- 17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation) (← links)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation) (← links)
- 17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240120305). PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (← links)
- 17938784. PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240128181). PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (← links)
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (← links)
- 18047033. PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (Intel Corporation) (← links)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation) (← links)