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Category:G02B6/136
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Pages in category "G02B6/136"
The following 27 pages are in this category, out of 27 total.
1
- 17809122. Photonic Package and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895342. CLADDING STRUCTURE FOR SEMICONDUCTOR WAVEGUIDE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17946656. SHARP ADIABATIC BENDS IN LOW-CONFINEMENT STRUCTURES simplified abstract (Cisco Technology, Inc.)
- 17956750. NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract (Intel Corporation)
- 17959967. METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES simplified abstract (Applied Materials, Inc.)
- 18094839. METHODS OF FORMING PHOTONIC DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18149260. PHOTONIC SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING THE PHOTONIC SOI SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151044. Packages With Photonic Engines and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18401811. PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517599. PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18526985. ELECTRO-OPTICAL MODULATOR USING WAVEGUIDES WITH OVERLAPPING RIDGES simplified abstract (Cisco Technology, Inc.)
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- Taiwan semiconductor manufacturing co., ltd. (20240094464). PHOTONIC SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING THE PHOTONIC SOI SUBSTRATE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240094469). Packages With Photonic Engines and Method of Forming the Same simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240136203). PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
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- US Patent Application 17664525. SEMICONDUCTOR WAVEGUIDES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18358790. METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING simplified abstract
- US Patent Application 18359894. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract