US Patent Application 18359894. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Yu-Kuang Liao of Hsinchu City (TW)
Wen-Chih Chiou of Miaoli County (TW)
Chen-Hua Yu of Hsinchu City (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359894 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
- This patent application describes a semiconductor device that includes a photonic die and an optical die. - The photonic die has a grating coupler and an optical device, which is connected to the grating coupler. - The optical device receives radiation of a specific wavelength that is incident on the grating coupler. - The optical die is placed over the photonic die and has a substrate with optical nanostructures. - The positions and shapes of the optical nanostructures are designed to perform an optical transformation on the incident radiation when it passes through the area of the substrate where the nanostructures are located. - The optical nanostructures are positioned above the grating coupler, so the incident radiation crosses the optical die with the nanostructures before reaching the grating coupler.
- The semiconductor device includes a grating coupler and an optical device that receives radiation of a specific wavelength.
- The optical die has optical nanostructures on its substrate that perform an optical transformation on the incident radiation.
- The optical nanostructures are positioned above the grating coupler, allowing the incident radiation to pass through them before reaching the grating coupler.
Original Abstract Submitted
A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupler to receive radiation of predetermined wavelength incident on the grating coupler. The optical die is disposed over the photonic die and includes a substrate with optical nanostructures. Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located. The optical nanostructures overlie the grating coupler so that the incident radiation of predetermined wavelength crosses the optical die where the optical nanostructures are located before reaching the grating coupler.
