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Category:H01L21/268
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This category has the following 37 subcategories, out of 37 total.
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Pages in category "H01L21/268"
The following 51 pages are in this category, out of 51 total.
1
- 17972626. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18261507. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD simplified abstract (Tokyo Electron Limited)
- 18368936. THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES (MICROSOFT TECHNOLOGY LICENSING, LLC)
- 18402991. INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18405418. METHOD FOR PRODUCING A VERTICAL SEMICONDUCTOR DEVICE WITH EPITAXIALLY GROWN III-V EPITAXY USING THE SUBSTRATE SEVERAL TIMES, AND CORRESPONDING SEMICONDUCTOR DEVICE, IN PARTICULAR BASED ON GALLIUM NITRIDE simplified abstract (Robert Bosch GmbH)
- 18441665. METHOD OF ANNEALING REFLECTIVE PHOTOMASK BY USING LASER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18493527. SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION (Western Digital Technologies, Inc.)
- 18540733. METHOD OF MANUFACTURING DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18584900. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (KABUSHIKI KAISHA TOSHIBA)
- 18584900. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18591438. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18596655. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Kioxia Corporation)
- 18620327. METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE simplified abstract (Infineon Technologies AG)
- 18628152. SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18741472. METHOD FOR WAFER DICING (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 18754620. METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNEALING A WAFER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18832370. MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF SEMICONDUCTOR SUBSTRATE, AND CONTROL DEVICE (KYOCERA Corporation)
- 18886502. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND VERTICAL POWER SEMICONDUCTOR DEVICE (Infineon Technologies AG)
- 18894401. WORKPIECE PROCESSING METHOD (DISCO CORPORATION)
- 18961960. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)
- 19019311. DIE CLEANING SYSTEMS AND RELATED METHODS (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
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- Kabushiki kaisha toshiba (20250095993). METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- KABUSHIKI KAISHA TOSHIBA patent applications on March 20th, 2025
- Kioxia corporation (20240297045). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240304494). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS simplified abstract
- Kioxia Corporation patent applications on September 12th, 2024
- KIOXIA CORPORATION patent applications on September 5th, 2024
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- Microsoft technology licensing, llc (20250096072). THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES
- MICROSOFT TECHNOLOGY LICENSING, LLC patent applications on March 20th, 2025
- Mitsubishi electric corporation (20240258134). SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract
- Mitsubishi Electric Corporation patent applications on August 1st, 2024
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- Samsung display co., ltd. (20240234150). METHOD OF MANUFACTURING DISPLAY DEVICE simplified abstract
- Samsung Display Co., LTD. patent applications on July 11th, 2024
- Samsung electronics co., ltd. (20240184192). METHOD OF ANNEALING REFLECTIVE PHOTOMASK BY USING LASER simplified abstract
- Samsung electronics co., ltd. (20240251496). SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF simplified abstract
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
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- Taiwan semiconductor manufacturing company, ltd. (20240136174). INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347355). METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNEALING A WAFER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062159). FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024