Category:John Harper of Chandler AZ (US)
John Harper
John Harper from Chandler AZ (US) has applied for patents in technology areas such as H01L23/24, B23K26/362, H01L21/268 with intel corporation.
Patents
Pages in category "John Harper of Chandler AZ (US)"
The following 4 pages are in this category, out of 4 total.
I
- Intel corporation (20240162134). VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES simplified abstract
- Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract
- Intel corporation (20250062168). Method and Stiffeners for Package Level Warpage Modulation