METHOD FOR WAFER DICING

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

METHOD FOR WAFER DICING

This abstract first appeared for US patent application 18741472 titled 'METHOD FOR WAFER DICING

Original Abstract Submitted

A wafer dicing method is provided, which includes: using a laser beam to perform a first dicing on a wafer to form a dicing lane on the wafer; using a bevel knife of a dicing machine to perform a second dicing in an inactive area of the wafer, wherein, before the second dicing, the bevel knife is raised to compensate for a thickness difference of the wafer in the inactive area and the dicing lane; and using the bevel knife to perform a third dicing in the dicing lane, wherein, during the third dicing, a wafer cut width of the second dicing is used to activate a Z-axis compensation mechanism of the dicing machine, so that the bevel knife cuts to a predetermined wafer cut width. As such, the applicable dicing lane width range of the bevel knife is increased via the precise control of the wafer cut width.