Category:Srinivas Pietambaram of Chandler AZ US
Srinivas Pietambaram
Srinivas Pietambaram from Chandler AZ US has applied for patents in technology areas such as H01L23/498, H01L21/48, H01L23/00 with intel corporation.
Patents
Pages in category "Srinivas Pietambaram of Chandler AZ US"
The following 32 pages are in this category, out of 32 total.
1
- 18371294. INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES (Intel Corporation)
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18374592. MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTRIC BASED LINER MATERIALS. (INTEL CORPORATION)
- 18375203. THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES (INTEL CORPORATION)
- 18375209. DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18478250. ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS (INTEL CORPORATION)
- 18478538. METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES (INTEL CORPORATION)
2
- 20250218678. Die Within Hole Subst (Intel)
- 20250218905. Component Coupled Condu (Intel)
- 20250218929. Embedded Deep Trench Capacit (Intel)
- 20250218953. Methods Apparatus Em (Intel)
- 20250218955. Microelectronic Structures I (Intel)
- 20250218956. Methods Apparatus Mo (Intel)
- 20250218957. Methods Apparatus Emb (Intel)
- 20250218963. Die Conductive Vias Embe (Intel)
- 20250218983. Microelectronic Structures I (Intel)
- 20250219028. Deep Trench Capacitors Mu (Intel)
- 20250703 Patent Applications Report for July 3rd, 2025
I
- Intel corporation (20250006616). HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
- Intel corporation (20250006646). THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Intel corporation (20250022908). MICRO LIGHT EMITTING DIODE STRUCTURES FORMED IN A RECESS OF A TRANSPARENT SUBSTRATE
- Intel corporation (20250107112). INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112100). DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112138). MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTRIC BASED LINER MATERIALS.
- Intel corporation (20250112161). METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112163). THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Intel corporation (20250112165). ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS