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20250218956. Methods Apparatus Mo (Intel)

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METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

Abstract: methods and apparatus for mounting semiconductor devices in cavities are disclosed herein. an example semiconductor package includes a package substrate core having a cavity positioned therein; a pedestal positioned within the cavity of the core, the pedestal including a conductive material; and a capacitor disposed within the cavity, the capacitor positioned on the pedestal.

Inventor(s): Shayan Kaviani, Ehsan Zamani, Mahdi Mohammadighaleni, Darko Grujicic, Rengarajan Shanmugam, Elham Tavakoli, Kihyun Kim, Srinivas Pietambaram

CPC Classification: H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))

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