20250218956. Methods Apparatus Mo (Intel)
METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
Abstract: methods and apparatus for mounting semiconductor devices in cavities are disclosed herein. an example semiconductor package includes a package substrate core having a cavity positioned therein; a pedestal positioned within the cavity of the core, the pedestal including a conductive material; and a capacitor disposed within the cavity, the capacitor positioned on the pedestal.
Inventor(s): Shayan Kaviani, Ehsan Zamani, Mahdi Mohammadighaleni, Darko Grujicic, Rengarajan Shanmugam, Elham Tavakoli, Kihyun Kim, Srinivas Pietambaram
CPC Classification: H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))
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- Patent Applications
- Intel Corporation
- CPC H01L23/5386
- Shayan Kaviani of Phoenix AZ US
- Ehsan Zamani of Phoenix AZ US
- Mahdi Mohammadighaleni of Phoenix AZ US
- Darko Grujicic of Chandler AZ US
- Rengarajan Shanmugam of Tempe AZ US
- Elham Tavakoli of Phoenix AZ US
- Kihyun Kim of Chandler AZ US
- Srinivas Pietambaram of Chandler AZ US