18371294. INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES (Intel Corporation)
INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
Organization Name
Inventor(s)
Brandon C. Marin of Gilbert AZ US
Srinivas Pietambaram of Chandler AZ US
Mohammad Mamunur Rahman of Gilbert AZ US
Sashi Shekhar Kandanur of Phoenix AZ US
Aleksandar Aleksov of Chandler AZ US
Tarek A. Ibrahim of Mesa AZ US
Rahul N. Manepalli of Chandler AZ US
INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
This abstract first appeared for US patent application 18371294 titled 'INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
Original Abstract Submitted
Coaxial magnetic inductor structures useful for semiconductor packaging applications are provided. The coaxial magnetic inductors can be located in semiconductor package cores and the semiconductor package cores can be, for example, comprised of an amorphous solid glass material. Methods of manufacturing a coaxial magnetic inductors in a package substrate core are also provided.
- Intel Corporation
- Brandon C. Marin of Gilbert AZ US
- Srinivas Pietambaram of Chandler AZ US
- Mohammad Mamunur Rahman of Gilbert AZ US
- Sashi Shekhar Kandanur of Phoenix AZ US
- Aleksandar Aleksov of Chandler AZ US
- Tarek A. Ibrahim of Mesa AZ US
- Rahul N. Manepalli of Chandler AZ US
- H01L23/48
- H01L23/498
- CPC H10D1/20