Category:C23C14/34
- Section C: Chemistry; Metallurgy
- Class C23: Coating Metallic Material; Coating Material With Metallic Material
- Subclass C23C: Coating Metallic Material
- Main Group C23C14/00: Coating by vacuum evaporation, by sputtering, or by ion implantation of the coating forming material
- Subgroup C23C14/34: Coating on selected surface areas, e.g., using masks
Classification "C23C14/34" relates to methods and processes in the field of chemistry and metallurgy, specifically focusing on coating metallic materials. This subgroup pertains to the techniques of vacuum evaporation, sputtering, or ion implantation for depositing coating material, with a particular emphasis on applying coatings to selected areas of a surface, often using masks. This technique is crucial in various industrial applications, including the manufacture of semiconductor devices, where precise and selective coating is essential for functionality. The use of masks in these processes allows for selective deposition, enabling intricate patterns and structures essential for modern electronic components and other advanced material applications.
Pages in category "C23C14/34"
The following 25 pages are in this category, out of 25 total.
1
- 17384310. DEPOSITION SYSTEM AND METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17662107. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17950046. Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber simplified abstract (Applied Materials, Inc.)
- 18132420. SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18237934. METHODS AND APPARATUS FOR CONTROLLING ION FRACTION IN PHYSICAL VAPOR DEPOSITION PROCESSES simplified abstract (Applied Materials, Inc.)
- 18272438. Deposition Of Piezoelectric Films simplified abstract (Applied Materials, Inc.)
- 18464273. PIEZOELECTRIC ELEMENT, PIEZOELECTRIC FILM, AND MANUFACTURING METHOD FOR PIEZOELECTRIC FILM simplified abstract (FUJIFILM Corporation)
- 18477060. FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract (Tokyo Electron Limited)
- 18513448. SEALING ARTICLE COMPRISING METAL COATING, METHOD OF MAKING AND METHOD OF USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18514111. ECG Electrode, Fabrication Method Thereof, and Electronic Device simplified abstract (Huawei Technologies Co., Ltd.)
- 18515842. Semiconductor Device, Method and Machine of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521446. SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING simplified abstract (Applied Materials, Inc.)
B
T
- Taiwan semiconductor manufacturing co., ltd. (20240093357). Semiconductor Device, Method and Machine of Manufacture simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
U
- US Patent Application 18230669. IN SITU AND TUNABLE DEPOSITION OF A FILM simplified abstract
- US Patent Application 18360667. PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME simplified abstract
- US Patent Application 18361729. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18447543. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract
- US Patent Application 18447911. DEPOSITION SYSTEM AND METHOD simplified abstract
