17950046. Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber simplified abstract (Applied Materials, Inc.)
Contents
- 1 Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber
Organization Name
Inventor(s)
Zhiyong Wang of San Jose CA (US)
Zheyuan Chen of San Jose CA (US)
Irena H. Wysok of San Jose CA (US)
Sundarapandian Ramalinga Vijayalakshmi Reddy of Bangalore (IN)
Avinash Nayak of Bangalore (IN)
Jianxin Lei of Fremont CA (US)
Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber - A simplified explanation of the abstract
This abstract first appeared for US patent application 17950046 titled 'Glassy Carbon Shutter Disk For Physical Vapor Deposition (PVD) Chamber
Simplified Explanation
The patent application describes a method and apparatus for reducing defects in substrates processed in a physical vapor (PVD) chamber by cleaning a process kit using a glassy carbon shutter disk and an oxygen-containing cleaning gas plasma reactive with carbon-based materials.
- Glassy carbon shutter disk positioned on substrate support
- Energizing oxygen-containing cleaning gas to create plasma reactive with carbon-based materials
- Heating process kit with carbon-based material adhered to remove at least a portion of the material
Potential Applications
The technology could be applied in semiconductor manufacturing, solar panel production, and other industries where clean substrates are crucial for product quality.
Problems Solved
The technology helps reduce defects in substrates processed in a PVD chamber by effectively cleaning carbon-based materials adhered to process kits, improving overall product quality and yield.
Benefits
- Improved substrate quality - Reduced defects in processed substrates - Increased product yield
Potential Commercial Applications
"Defect-Reducing Technology for PVD Chambers" could be used in semiconductor fabrication facilities, solar panel manufacturing plants, and other high-tech industries requiring precise and clean substrates.
Possible Prior Art
There may be prior art related to plasma cleaning methods for process chambers, but specific details would need to be researched further.
Unanswered Questions
How does this technology compare to traditional cleaning methods for process kits in PVD chambers?
The article does not provide a direct comparison between this technology and traditional cleaning methods for process kits in PVD chambers. Further research would be needed to determine the specific advantages and disadvantages of this new approach.
What are the potential environmental impacts of using an oxygen-containing cleaning gas in this process?
The article does not address the potential environmental impacts of using an oxygen-containing cleaning gas in the cleaning process. Further analysis would be required to assess any environmental concerns related to this technology.
Original Abstract Submitted
Methods and apparatus reduce defects in substrates processed in a physical vapor (PVD) chamber. In some embodiments, a method for cleaning a process kit disposed in an inner volume of a process chamber includes positioning a glassy carbon shutter disk on a substrate support of the PVD chamber; energizing an oxygen-containing cleaning gas disposed in the inner volume of the PVD chamber to create a plasma reactive with carbon-based materials; and heating the process kit having a carbon-based material adhered thereto while exposed to the plasma to remove at least a portion of the carbon-based material adhered to the process kit.
