18515842. Semiconductor Device, Method and Machine of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Semiconductor Device, Method and Machine of Manufacture

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Jen-Chun Wang of Chiayi City (TW)

Ya-Lien Lee of Baoshan Township (TW)

Chih-Chien Chi of Hsinchu (TW)

Hung-Wen Su of Jhubei City (TW)

Semiconductor Device, Method and Machine of Manufacture - A simplified explanation of the abstract

This abstract first appeared for US patent application 18515842 titled 'Semiconductor Device, Method and Machine of Manufacture

Simplified Explanation

The semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber, specifically in a sputtering process by adjusting coil distance or applying/removing power from additional coils.

• The electromagnetic field within a deposition chamber is modified to enhance the semiconductor manufacturing process.
• Adjusting the distance between coils and mounting platform or applying/removing power from additional coils can optimize the deposition process.

Potential Applications

The technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, solar cells, and sensors.

Problems Solved

This technology helps in improving the efficiency and quality of semiconductor manufacturing processes by optimizing the deposition of materials.

Benefits

- Enhanced semiconductor device performance - Increased manufacturing efficiency - Improved product quality and reliability

Potential Commercial Applications

"Optimizing Semiconductor Manufacturing Processes with Electromagnetic Field Modification"

Possible Prior Art

There are existing methods for modifying electromagnetic fields in deposition chambers, such as adjusting coil configurations or power levels. However, this specific approach of modifying the electromagnetic field for semiconductor device manufacturing may be novel.

Unanswered Questions

How does the modification of the electromagnetic field impact the overall yield of semiconductor devices?

The article does not provide specific data on how the modification of the electromagnetic field affects the yield of semiconductor devices.

Are there any limitations to the modification of the electromagnetic field in semiconductor manufacturing processes?

The article does not address any potential limitations or challenges that may arise from modifying the electromagnetic field in semiconductor manufacturing processes.

Original Abstract Submitted

A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.