Semiconductor Device, Method and Machine of Manufacture

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Semiconductor Device, Method and Machine of Manufacture - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240093357 titled 'Semiconductor Device, Method and Machine of Manufacture

Simplified Explanation

A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments where the deposition process is a sputtering process, the electromagnetic field can be adjusted by changing the distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field can be modified by applying or removing power from additional coils present.

Explanation of the patent/innovation:

 - Modifying an electromagnetic field within a deposition chamber to manufacture semiconductor devices.
 - Adjusting the electromagnetic field in sputtering processes by changing the distance between coils and the mounting platform.
 - Modifying the electromagnetic field by applying or removing power from additional coils.

Potential Applications

The technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, transistors, and diodes.

Problems Solved

1. Enhanced control over the deposition process. 2. Improved efficiency in semiconductor device manufacturing.

Benefits

1. Increased precision in semiconductor device fabrication. 2. Cost-effective production methods. 3. Enhanced performance of semiconductor devices.

Potential Commercial Applications

Optimizing Semiconductor Manufacturing Processes for Enhanced Efficiency

Possible Prior Art

Prior art may include patents related to electromagnetic field manipulation in deposition processes for semiconductor device manufacturing.

Unanswered Questions

How does the modification of the electromagnetic field impact the quality of the semiconductor devices produced?

The quality control measures and standards for the semiconductor devices manufactured using this technology are not explicitly discussed in the abstract.

Are there any limitations to the modification of the electromagnetic field within the deposition chamber?

The potential constraints or challenges associated with adjusting the electromagnetic field during the deposition process are not addressed in the abstract.

Original Abstract Submitted

a semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. in embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. in other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.

Taiwan semiconductor manufacturing co., ltd. (20240093357). Semiconductor Device, Method and Machine of Manufacture simplified abstract

Contents

Semiconductor Device, Method and Machine of Manufacture

Organization Name

Inventor(s)