18521446. SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING simplified abstract (Applied Materials, Inc.)
Contents
- 1 SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING
Organization Name
Inventor(s)
Harish V Penmethsa of Dublin CA (US)
Suresh Palanisamy of Coimbatore (IN)
Dinesh Rajamanickam of Coimbatore (IN)
Naresh Kumar Asokan of Coimbatore (IN)
SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521446 titled 'SUBSTRATE FLIPPING IN VACUUM FOR DUAL SIDED PVD SPUTTERING
Simplified Explanation
The abstract describes a patent application for a processing system module that flips a substrate in a vacuum using a clamp assembly, first motor assembly for rotation, and second motor assembly for raising and lowering.
- The module includes a clamp assembly to secure the substrate.
- A first motor assembly is used to rotate the clamp assembly.
- A second motor assembly is coupled to the first motor assembly to raise and lower the clamp assembly.
Potential Applications
This technology could be used in semiconductor manufacturing, thin film deposition processes, and other vacuum-based processing industries.
Problems Solved
This technology solves the problem of efficiently flipping substrates in a vacuum environment, which is crucial for certain manufacturing processes.
Benefits
The benefits of this technology include increased automation, precision, and efficiency in substrate flipping processes within a vacuum environment.
Potential Commercial Applications
Potential commercial applications for this technology include semiconductor fabrication facilities, research institutions, and companies involved in vacuum-based processing.
Possible Prior Art
One possible prior art could be similar systems used in semiconductor manufacturing or other vacuum-based processing industries.
Unanswered Questions
How does this technology compare to existing substrate flipping systems in terms of speed and accuracy?
This article does not provide a direct comparison between this technology and existing systems in terms of speed and accuracy.
What are the potential maintenance requirements for this system and how do they impact overall operational costs?
This article does not address the potential maintenance requirements for this system or how they may impact operational costs.
Original Abstract Submitted
A module of a processing system for flipping a substrate in vacuum includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.
