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Category:H01G4/008
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Pages in category "H01G4/008"
The following 162 pages are in this category, out of 162 total.
1
- 17750742. DIELECTRIC MATERIAL, DEVICE INCLUDING THE SAME, AND METHOD OF PREPARING THE DIELECTRIC MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17835854. HIGH DENSITY METAL LAYERS IN ELECTRODE STACKS FOR TRANSITION METAL OXIDE DIELECTRIC CAPACITORS simplified abstract (Intel Corporation)
- 17861577. CAPACITOR, METHOD OF FABRICATING THE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE CAPACITOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18047978. MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18127808. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18132195. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18136418. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18139444. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18145597. CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18184119. Treatment of Electrodes of MIM Capacitors simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18198533. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18209619. MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18224670. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18226694. ANTIFERROELECTRIC CONTAINING DYSPROSIUM AND A MANUFACTURING METHOD THEREOF simplified abstract (Hyundai Motor Company)
- 18226694. ANTIFERROELECTRIC CONTAINING DYSPROSIUM AND A MANUFACTURING METHOD THEREOF simplified abstract (Kia Corporation)
- 18231324. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235067. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235531. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD OF THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18312827. CAPACITOR, ELECTRONIC DEVICE INCLUDING THE SAME, AND METHOD OF PREPARING THE CAPACITOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18346125. EXTREMELY HIGH DENSITY SILICON CAPACITOR (International Business Machines Corporation)
- 18347938. CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND ELECTRONIC APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18363045. CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18368771. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18372870. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18372871. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18374313. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18380810. CAPACITOR COMPONENT AND MANUFACTURING METHOD OF CAPACITOR COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18384796. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18400411. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18400532. MULTILAYERED CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18406839. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18415009. MULTILAYER CERAMIC CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18422743. MULTILAYER CERAMIC ELECTRONIC COMPONENT (Samsung Electro-Mechanics Co., Ltd.)
- 18429623. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18432669. MULTILAYER CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18435335. MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18436162. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18487058. LAMINATED CERAMIC COMPONENT simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18494499. CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT BOARD, AND APPARATUS simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18498794. MULTILAYER ELECTRONIC DEVICE simplified abstract (TDK CORPORATION)
- 18510973. CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18527439. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18540134. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18540138. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18544505. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18580481. CONDUCTIVE PASTE FOR ELECTRODE FORMATION simplified abstract (KYOCERA CORPORATION)
- 18583094. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18584412. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18593693. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18598294. ELECTRONIC COMPONENT AND MOUNTING METHOD AND MOUNTING STRUCTURE THEREOF simplified abstract (Murata Manufacturing Co., Ltd.)
- 18598301. CONDUCTIVE PASTE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18598306. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18606126. CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18608994. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18608997. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609020. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609022. CONDUCTIVE PASTE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609537. ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT STRUCTURE simplified abstract (TDK CORPORATION)
- 18609964. CAPACITOR COMPONENT INCLUDING INDIUM AND TIN, AND METHOD OF MANUFACTURING THE CAPACITOR COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18610464. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18618166. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18619245. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18641986. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18661768. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667267. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667273. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667780. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18673499. METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18673694. MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18675491. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18677976. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18733322. ELECTRONIC COMPONENT simplified abstract (TDK CORPORATION)
- 18746113. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18754226. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18754231. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18754232. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18754245. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18755757. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18755758. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18757900. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18796371. MUTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18814857. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18814950. CERAMIC ELECTRONIC COMPONENT INCLUDING BONDING LAYER BETWEEN BODY AND SINTERED EXTERNAL ELECTRODE (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18816287. CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18817544. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18966314. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18971341. MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
H
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- Micron technology, inc. (20240234482). MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONIC SYSTEMS AND METHODS simplified abstract
- Micron Technology, Inc. patent applications on July 11th, 2024
- Murata manufacturing co., ltd. (20240186065). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240242889). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240242890). MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240249889). MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240266118). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240282532). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240296995). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240304363). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240304388). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240304393). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240312710). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240312712). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240312723). METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240347277). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240420889). CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR
- Murata manufacturing co., ltd. (20240420890). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240420892). MUTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240420896). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240428992). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250006429). MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Murata manufacturing co., ltd. (20250014818). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250014819). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250014820). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250014828). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250014829). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250014830). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250014831). MULTILAYER CERAMIC CAPACITOR
- Murata Manufacturing Co., Ltd. patent applications on August 22nd, 2024
- Murata Manufacturing Co., Ltd. patent applications on August 8th, 2024
- Murata Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Murata Manufacturing Co., Ltd. patent applications on December 26th, 2024
- Murata Manufacturing Co., Ltd. patent applications on February 13th, 2025
- Murata Manufacturing Co., Ltd. patent applications on February 20th, 2025
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
- Murata Manufacturing Co., Ltd. patent applications on January 23rd, 2025
- MURATA MANUFACTURING CO., LTD. patent applications on January 2nd, 2025
- Murata Manufacturing Co., Ltd. patent applications on January 30th, 2025
- Murata Manufacturing Co., Ltd. patent applications on January 9th, 2025
- Murata Manufacturing Co., Ltd. patent applications on July 18th, 2024
- Murata Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Murata Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 12th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 19th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 5th, 2024
S
- Samsung electro-mechanics co., ltd. (20240212940). MULTILAYER ELECTRONIC COMPONENT simplified abstract
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on March 6th, 2025
- Samsung electronics co., ltd. (20240213303). CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND ELECTRONIC APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240213306). CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258365). CAPACITOR AND DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240429267). CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Samsung electronics co., ltd. (20250006778). CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- SK hynix Inc. patent applications on March 6th, 2025
T
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- US Patent Application 17969189. MULTILAYER ELECTRONIC COMPONENT simplified abstract
- US Patent Application 18125868. MULTILAYER ELECTRONIC COMPONENT simplified abstract
- US Patent Application 18232050. MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON simplified abstract
- US Patent Application 18315563. DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
