Murata Manufacturing Co., Ltd. patent applications on January 30th, 2025
Patent Applications by Murata Manufacturing Co., Ltd. on January 30th, 2025
Murata Manufacturing Co., Ltd.: 28 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H03H9/17 (4), H01M4/62 (3), H01M4/02 (3), H03H9/02 (3), H03H9/56 (3) A61M1/3679 (1), H01M50/534 (1), H04B1/04 (1), H04B1/006 (1), H04B1/0057 (1)
With keywords such as: electrode, layer, direction, portion, surface, substrate, dielectric, filter, conductor, and wave in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Yuki KIMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ichitaro Okamura of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takeshi Torita of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yusuke Kobayashi of Yokohama-shi (JP) for murata manufacturing co., ltd., Hiromichi Wakui of Yokohama-shi (JP) for murata manufacturing co., ltd., Kengo Azushima of Yokohama-shi (JP) for murata manufacturing co., ltd., Kouichi Tamura of Yokohama-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): A61M1/36
CPC Code(s): A61M1/3679
Abstract: an adsorbent material used for adsorbing a disease-causing substance, the adsorbent material including two-dimensional particles having one or plural layers, the one or plural layers containing a layer body represented by: mx, wherein m is at least one metal of group 3, 4, 5, 6, or 7, x is a carbon atom, a nitrogen atom, or a combination thereof, n is not less than 1 and not more than 4, m is more than n but not more than 5, and a modifier or terminal t exists on a surface of the layer body, wherein t is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom.
20250034441. ADHESIVE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Naoki OGAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoshitaka MURAKAMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): C09J163/00, C08G59/24, C08K3/013, C08K5/54, C09J11/04, C09J11/06, H01F27/26
CPC Code(s): C09J163/00
Abstract: an adhesive includes a bisphenol f resin, a curing agent for the bisphenol f resin, and magnetic powder. the volume ratio of the magnetic powder to the adhesive is 35 vol % or lower. the number average molecular weight of the bisphenol f resin is 312 to 360 g/mol.
Inventor(s): Katsuhisa KASHIWAGI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): G01S13/42, G01S13/00, G01S13/58
CPC Code(s): G01S13/42
Abstract: a positioning system includes a transceiver and a signal processing unit. the signal processing unit acquires a plurality of antenna data from the transceiver, the antenna data being obtained by radio waves being transmitted and received between transmitting antennas and receiving antennas. in angle estimation processing of the target by employing an annihilating filter method, the signal processing unit generates a convolution matrix by stacking the plurality of antenna data in a row direction of a matrix and combining the antenna data, and determines a filter coefficient vector from simultaneous equations expressed by using a matrix product of the convolution matrix and the filter coefficient vector. the signal processing unit calculates a phase difference between antennas from the determined filter coefficient vector and performs an operation to estimate an arrival angle of the reflected wave from the target.
Inventor(s): Hirofumi SUNAHARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takaaki YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): G06Q30/02, G06Q40/04, H04L9/00, H04L9/06, H04L67/104
CPC Code(s): G06Q30/02
Abstract: an agent for modulating expression of a heat shock protein gene, comprising a sp. derived from var. or . also described are compositions comprising the same, as well as methods of making and using such agents and compositions.
20250037919. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yasushi SHIGENO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F17/00, H03H7/01
CPC Code(s): H01F17/0013
Abstract: in an electronic component, a first inductor includes a spiral-shaped first conductor pattern portion. a second inductor includes a spiral-shaped second conductor pattern portion. an insulating layer includes an interlayer insulating film that covers the first inductor and a second conductor pattern portion of the second inductor is provided on the interlayer insulating film. the second conductor pattern portion of the second inductor includes a first portion that overlaps the first conductor pattern portion of the first inductor and a second portion that does not overlap the first conductor pattern portion of the first inductor in plan view in the thickness direction of the substrate. the second inductor includes a third conductor pattern portion formed in the interlayer insulating film, and at least a portion of the third conductor pattern portion overlaps the second portion of the second conductor pattern portion.
20250037922. COIL COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Masaki KITAJIMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoshitaka MURAKAMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F27/26, H01F5/02
CPC Code(s): H01F27/263
Abstract: a coil component includes a drum core as a first core and a top plate as a second core. the coil component also includes a wire and an adhesive. the adhesive includes a bisphenol f resin, magnetic powder, and a curing agent. a cross section perpendicular to an adhesion surface between the adhesive and the drum core is set to a specific cross section. a direction perpendicular to the adhesion surface is set to a thickness direction. a direction perpendicular to the thickness direction in the specific cross section is set to an extending direction. the adhesive includes a resin portion in the specific cross section. the resin portion is a portion which does not contain the magnetic powder in the thickness direction in a range between the drum core and the top plate and which is continuously disposed by 3 �m or larger in the extending direction.
20250037924. INDUCTOR COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yugo TAKEOKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kenichi TANI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuichirou YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F27/28
CPC Code(s): H01F27/2804
Abstract: an inductor component includes an element body, a coil in the element body and spirally wound along an axis, and first and second outer electrodes in the element body and electrically connected to the coil. the first and second outer electrodes are at least on the bottom surface of the element body. the axis is parallel to the bottom surface and intersects the first and second side surfaces of the element body. when viewed from an axial direction, the inner diameter of the coil includes a first inner diameter dimension in a length direction in which the first and second end surfaces of the element body face each other and a second inner diameter dimension in a height direction in which the top and bottom surfaces of the element body face each other.
Inventor(s): Hirofumi OIE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takamori IGARASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Makoto TAKADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/12, H01G4/008, H01G4/30
CPC Code(s): H01G4/1227
Abstract: a multilayer ceramic electronic component that includes: a ceramic layer that contains a ba—nd—ti oxide, forsterite, barium borosilicate glass, and mno; and an electrode in contact with the ceramic layer, wherein the ceramic layer includes a nd uneven distribution portion where nd is unevenly distributed at an interface where the ceramic layer is in contact with the electrode.
Inventor(s): Kazuto YAMAZAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tomomichi ICHIKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/18, C08G18/58, C08G18/76, C08J5/18
CPC Code(s): H01G4/18
Abstract: a dielectric resin film that includes: a dielectric resin film body that has two principal surfaces opposite to each other; and one or more insulating protrusions on at least one of the two principal surfaces, each of the one or more insulating protrusions having: a density of 1 piece/cmto 10 pieces/cm, an average height of 2 �m or more, and an average area of 550 �mor more as viewed from a normal direction of the at least one of the two principal surfaces.
20250037939. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Akito MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masahiro WAKASHIMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Sho WATANABE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takumi ENDOU of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/12
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes a multilayer body including an inner layer portion including internal electrode layers and inner dielectric layers laminated alternately, and internal electrode layers at both ends thereof in a lamination direction, and outer dielectric layers covering the inner layer portion, and two external electrodes on both end surfaces of the multilayer body in a length direction intersecting the lamination direction. the inner and outer dielectric layers each include grains, and a difference between an average grain size of grains in the inner dielectric layers and an average grain size of grains in the outer dielectric layers is about 100 nm or less.
20250038157. POWER SUPPLY MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takami MUTO of San Jose CA (US) for murata manufacturing co., ltd., Hiroki MINAMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Munetake MIYASHITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masanari TAGO of San Jose CA (US) for murata manufacturing co., ltd.
IPC Code(s): H01L25/16, H01L23/31, H01L23/367, H01L23/538
CPC Code(s): H01L25/162
Abstract: a power supply module includes a first substrate; a control ic, a capacitor, a first electronic component, a second electronic component, a third electronic component and a fourth electronic component on a principal surface of the first substrate; a first submodule including a second substrate above the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component and including a fifth electronic component, a sixth electronic component, and a seventh electronic component on a principal surface of the second substrate; and a resin covering an upper portion of the first submodule.
Inventor(s): Yan ZHOU of Shanghai (CN) for murata manufacturing co., ltd., Li WANG of Shanghai (CN) for murata manufacturing co., ltd., Yuli LI of Shanghai (CN) for murata manufacturing co., ltd.
IPC Code(s): H01M4/36, H01M4/02, H01M4/133, H01M4/48, H01M4/587, H01M4/62, H01M10/0525
CPC Code(s): H01M4/364
Abstract: a negative electrode plate for a lithium battery and a lithium-ion secondary battery including same are provided. the negative electrode plate for a lithium battery including a current collector and a negative electrode material, wherein the negative electrode material includes graphite, silicon monoxide siox without carbon coating, and a conductive agent including a carbon nanotube, wherein 1.6>x>0; and a lithium-ion secondary battery including the negative electrode plate.
Inventor(s): Yuli LI of Shanghai (CN) for murata manufacturing co., ltd., Li WANG of Shanghai (CN) for murata manufacturing co., ltd., Kazumasa TAKESHI of Shanghai (CN) for murata manufacturing co., ltd., Siming YANG of Shanghai (CN) for murata manufacturing co., ltd.
IPC Code(s): H01M4/36, C01G53/00, H01M4/02, H01M4/1315, H01M4/525, H01M4/62, H01M10/0525, H01M10/42
CPC Code(s): H01M4/366
Abstract: a positive electrode composite material, a preparation method thereof, a positive electrode and a lithium ion secondary battery are provided. the positive electrode composite material includes a high-nickel positive electrode material; a lithium boron oxide coating a part of the surface of the high-nickel positive electrode material; and fluoride present in a dotted form on the other part of the surface of the high-nickel positive electrode material, the amount of residual lithium on the surface of the positive electrode composite material is less than about 0.3 wt %.
Inventor(s): Li WANG of Shanghai (CN) for murata manufacturing co., ltd., Yuli LI of Shanghai (CN) for murata manufacturing co., ltd., Kazumasa TAKESHI of Shanghai (CN) for murata manufacturing co., ltd.
IPC Code(s): H01M4/50, C01G45/02, H01M4/02, H01M4/04, H01M4/62, H01M10/36
CPC Code(s): H01M4/50
Abstract: a manganese dioxide positive electrode material, a positive electrode sheet and a preparation method therefor, and a zinc ion battery are provided. the manganese dioxide positive electrode material for a zinc ion battery includes a mixed material of micron-sized manganese dioxide particles and nano-sized manganese dioxide particles, an aqueous binder, and a conductive agent; wherein the micron-sized manganese dioxide particles have an average particle size of about 1 �m to about 10 �m, and the nano-sized manganese dioxide particles have an average particle size of about 100 nm to about 500 nm.
Inventor(s): Yoshiyuki BANNAI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/6567, H01M10/613, H01M50/682
CPC Code(s): H01M10/6567
Abstract: a heat absorbing member includes a heat absorbing agent and an exterior member accommodating the heat absorbing agent , the exterior member has a portion in contact with an object, and the portion has a groove
20250038370. SECONDARY BATTERY AND BATTERY PACK_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Masayuki IWAMA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M50/534, H01M10/0587, H01M50/107, H01M50/536
CPC Code(s): H01M50/534
Abstract: a secondary battery having higher operation reliability is provided. the secondary battery includes an electrode wound body, a positive electrode current collector plate, and a negative electrode current collector plate. the electrode wound body includes a positive electrode and a negative electrode. in a state where the electrode wound body is unwound, a negative electrode active material layer includes a third negative electrode edge part that is positioned to be inwardly retracted relative to a first intersection point at which an extension line of a first negative electrode edge part and an extension line of a second negative electrode edge part meet, and that couples the first negative electrode edge part and the second negative electrode edge part to each other. a second intersection point at which the first negative electrode edge part and the third negative electrode edge part meet is positioned between the first intersection point and a third intersection point, the third intersection point being a point at which the first negative electrode edge part and an extension line of a second positive electrode edge part meet.
20250038413. MULTILAYER SUBSTRATE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Kentarou KAWABE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q9/04
CPC Code(s): H01Q9/0407
Abstract: a second radiating conductor layer is provided to a multilayer body to be in contact with a second insulator layer, is positioned in a positive direction of a z-axis relative to a first radiating conductor layer, and overlaps the first radiating conductor layer assuming it is viewed in the z-axis direction. a frequency of an electromagnetic wave radiated or received by the second radiating conductor layer is higher than a frequency of an electromagnetic wave radiated or received by the first radiating conductor layer, or an area of the second radiating conductor layer is smaller than an area of the first radiating conductor layer. a first planar ground conductor layer is positioned in a negative direction of the z-axis relative to the first radiating conductor layer, and overlaps the first radiating conductor layer and the second radiating conductor layer assuming it is viewed in the z-axis direction.
20250038415. ANTENNA MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Kengo ONAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yosuke SATO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hirotsugu MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q9/04, H01Q1/48, H01Q5/10, H01Q5/50
CPC Code(s): H01Q9/0414
Abstract: an antenna module includes a first dielectric substrate at which a first radiating electrode with a flat plate shape is disposed and a second dielectric substrate at which a second radiating electrode shape is disposed. the first dielectric substrate has a first surface and a second surface that are opposite each other. the first radiating electrode is disposed on the second surface of the first dielectric substrate or at a position between the first and second surfaces of the first dielectric substrate. the second dielectric substrate includes a region that is arranged so as abut the first dielectric substrate and a region that is in contact with the first surface of the dielectric substrate. a normal direction of the radiating electrode is different from a normal direction of the radiating electrode.
20250038575. WIRELESS POWER RECEIVING DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Koyo KAIWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tatsuya HOSOTANI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H02J50/12, H01F27/24, H01F27/28, H01F38/14, H01M10/46, H02J50/40, H04R25/00
CPC Code(s): H02J50/12
Abstract: a wireless power receiving device includes power receiving coils, power receiving resonance circuits, and rectifier circuits. the power receiving coils each generate a power receiving current by being coupled to an external magnetic field. each power receiving resonance circuit includes a power receiving coil and a capacitor. the rectifier circuits are connected to the power receiving resonance circuits and rectify resonance currents, respectively. the power receiving coils are planar spiral coils, and the power receiving coils are cylindrical solenoid coils. the power receiving coils and the power receiving coils are disposed in a state where a direction orthogonal to a plane of the spiral coil and axes of cylindrical shapes of the solenoid coils are not parallel to each other. a power adding circuit adds dc outputs of the rectifier circuits at a subsequent stage of the rectifier circuits and supplies power to a load.
Inventor(s): Gary Chunshien Wu of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H02M1/00, H02M3/04
CPC Code(s): H02M1/0003
Abstract: a 2-bit fast flash analog-to-digital converter circuit and related methods designed for use with multi-level converters in particular to achieve: high conversion speed, high resolution, small layout area, low power, and the ability to meet the requirements for properly balancing fly capacitor voltages. one embodiment includes a voltage input configured to be coupled to a multi-level converter fly capacitor; a comparator coupled to the voltage input and a first reference voltage input and having a first binary output indicating whether the input voltage is higher or lower than a voltage on the first reference voltage input; and a circuit coupled to the voltage input and to second and third reference voltage inputs, the circuit configured to provide a second binary output indicating whether the input voltage is inside or outside a voltage window defined by respective voltages on the second reference and third reference voltage inputs.
20250038730. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Munehisa WATANABE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kazunori INOUE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H03H9/13, H03H9/17, H03H9/56
CPC Code(s): H03H9/02086
Abstract: an acoustic wave device includes acoustic wave resonators including one or more series arm resonators and one or more parallel arm resonators. the acoustic wave resonators include a support including a support substrate with a thickness in a first direction, a piezoelectric layer in the first direction of the support, an idt electrode on one principal surface of the piezoelectric layer, a first dielectric film on the one principal surface, and a second dielectric film on the first dielectric film. a thickness of one of the first dielectric films is larger than a thickness of another one of the first dielectric films. a thickness of one of the second dielectric films is smaller than a thickness of another one of the second dielectric films.
Inventor(s): Albert Cardona of Santa Barbara CA (US) for murata manufacturing co., ltd., Drew MOROSIN of Oxnard CA (US) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H03H9/17, H03H9/56
CPC Code(s): H03H9/02228
Abstract: an acoustic resonator is provided that includes a substrate; a piezoelectric layer coupled to the substrate by one or more dielectric layers and having first and second surfaces that oppose each other; an interdigital transducer on at least one of the first and second surfaces of the piezoelectric layer and including interleaved fingers; and a capacitor electrically coupled in parallel to the interdigital transducer and including at least one first electrode on the first surface of the piezoelectric layer and a metal layer on the second surface of the piezoelectric layer, such that the piezoelectric layer is sandwiched between the at least one first electrode and the metal layer.
Inventor(s): Shozo OTERA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/05, H03H9/17
CPC Code(s): H03H9/05
Abstract: a vibration device including: a support member that includes a fixed portion, a movable portion having an upper main surface and a lower main surface arranged in an up-down direction, the movable portion constructed to support a vibrated member; an actuator attached to the fixed portion and the movable portion or the vibrated member, and constructed to vibrate the vibrated member in a left-right direction; an elastic coupling portion that elastically couples the fixed portion and the movable portion in a left-right direction, the elastic coupling portion having a first elastic coefficient in the left-right direction and a second elastic coefficient in the up-down direction, and the second elastic coefficient is smaller than the first elastic coefficient.
Inventor(s): John P. KOULAKIS of Los Angeles CA (US) for murata manufacturing co., ltd.
IPC Code(s): H03H9/13, H03H3/02, H03H9/02, H03H9/17, H03H9/56
CPC Code(s): H03H9/132
Abstract: an acoustic resonator device is provided that a piezoelectric layer; an interdigital transducer on a surface of the piezoelectric layer and including interleaved idt fingers extending from first and second busbars respectively; and a metal layer disposed between a finger of the interleaved idt fingers and the piezoelectric layer in a thickness direction that is measured in a direction normal to the surface of the piezoelectric layer. in this aspect, a ratio of a width of the metal layer to a pitch of the interleaved idt fingers is greater than or equal to 0.45, the width of the metal layer being measured in a width direction that is parallel to the surface of the piezoelectric layer. moreover, a thickness of the metal layer in the thickness direction is less than one third a thickness of the finger in the thickness direction.
20250038772. RADIO FREQUENCY CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Shoji NAGUMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/00, H04B1/04
CPC Code(s): H04B1/0057
Abstract: a radio frequency circuit includes a divider including a first, second, and third terminals. a first multiplexer includes a first filter having a first passband and a second filter having a second, higher passband. a first switch includes a first terminal, a second terminal connected to the first terminal of the divider, and a third terminal connected to first ends of the first and second filters. a second switch includes a first terminal, a second terminal connected to the third terminal of the divider, and a third terminal connected to a second end of the first filter. a third filter has a wlan passband, and a first amplifier is connected to a first end of the third filter. the first terminal of the first switch is connected to the first amplifier or the first terminal of the second switch is connected to a second end of the third filter.
Inventor(s): Hiroyuki KANI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoshihiro YOSHIMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kiyoshi AIKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takahiro YAMASHITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuusuke SUZUKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hidetaka TAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takanori ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takuma KUROYANAGI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/00, H03H9/64, H04B1/16
CPC Code(s): H04B1/006
Abstract: a radio frequency module includes a mounting board, a first acoustic wave filter including a first support disposed at a first main surface of the mounting board, a second acoustic wave filter including a second support disposed on the first acoustic wave filter, and a shield electrode. the shield electrode covers at least a part of the resin layer. the first acoustic wave filter and the second acoustic wave filter pass signals to perform simultaneous communication. a main surface of the second acoustic wave filter on an opposite side from a first acoustic wave filter side is in contact with the shield electrode. a ground electrode of the mounting board is connected to a functional electrode of the first acoustic wave filter.
20250038774. RADIO FREQUENCY CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Isao TAKENAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/04, H03H9/64, H04B1/10
CPC Code(s): H04B1/04
Abstract: a radio frequency circuit includes an antenna connection terminal, an acoustic wave filter, a power amplifier connected to the acoustic wave filter, a temperature sensor that measures the temperature of either one or both of the acoustic wave filter and the power amplifier, a first variable inductor circuit that includes an inductor disposed in series between the acoustic wave filter and the antenna connection terminal and that has a variable inductance value, and a second variable inductor circuit that includes an inductor connected between the ground and a first path connecting the acoustic wave filter to the antenna connection terminal and that has a variable inductance value.
20250039611. MEMS ACOUSTIC ELEMENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Ryosuke NIWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shinsuke IKEUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hiroshi MATSUBARA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04R17/02, B81B7/00, B81C1/00
CPC Code(s): H04R17/02
Abstract: a device may include a first substrate provided with a first through hole. a device may include a second substrate arranged adjacent to the first through hole and configured to partially overlap with the first substrate on a second side of the first substrate. a device may include a vibration layer arranged adjacent to and overlap with the first substrate on a first side of the first substrate opposite the second substrate and configured to stride across the first through hole. a device may include a resin layer disposed to overlap with a portion of the vibration layer overlapping with the first substrate. a device may include a first pad electrode. a device may include a second pad electrode. a device may include the first pad electrode and the second pad electrode being disposed on a surface of the resin layer opposite from the vibration layer.
Murata Manufacturing Co., Ltd. patent applications on January 30th, 2025
- Murata Manufacturing Co., Ltd.
- A61M1/36
- CPC A61M1/3679
- Murata manufacturing co., ltd.
- C09J163/00
- C08G59/24
- C08K3/013
- C08K5/54
- C09J11/04
- C09J11/06
- H01F27/26
- CPC C09J163/00
- G01S13/42
- G01S13/00
- G01S13/58
- CPC G01S13/42
- G06Q30/02
- G06Q40/04
- H04L9/00
- H04L9/06
- H04L67/104
- CPC G06Q30/02
- H01F17/00
- H03H7/01
- CPC H01F17/0013
- H01F5/02
- CPC H01F27/263
- H01F27/28
- CPC H01F27/2804
- H01G4/12
- H01G4/008
- H01G4/30
- CPC H01G4/1227
- H01G4/18
- C08G18/58
- C08G18/76
- C08J5/18
- CPC H01G4/18
- CPC H01G4/30
- H01L25/16
- H01L23/31
- H01L23/367
- H01L23/538
- CPC H01L25/162
- H01M4/36
- H01M4/02
- H01M4/133
- H01M4/48
- H01M4/587
- H01M4/62
- H01M10/0525
- CPC H01M4/364
- C01G53/00
- H01M4/1315
- H01M4/525
- H01M10/42
- CPC H01M4/366
- H01M4/50
- C01G45/02
- H01M4/04
- H01M10/36
- CPC H01M4/50
- H01M10/6567
- H01M10/613
- H01M50/682
- CPC H01M10/6567
- H01M50/534
- H01M10/0587
- H01M50/107
- H01M50/536
- CPC H01M50/534
- H01Q9/04
- CPC H01Q9/0407
- H01Q1/48
- H01Q5/10
- H01Q5/50
- CPC H01Q9/0414
- H02J50/12
- H01F27/24
- H01F38/14
- H01M10/46
- H02J50/40
- H04R25/00
- CPC H02J50/12
- H02M1/00
- H02M3/04
- CPC H02M1/0003
- H03H9/02
- H03H9/13
- H03H9/17
- H03H9/56
- CPC H03H9/02086
- CPC H03H9/02228
- H03H9/05
- CPC H03H9/05
- H03H3/02
- CPC H03H9/132
- H04B1/00
- H04B1/04
- CPC H04B1/0057
- H03H9/64
- H04B1/16
- CPC H04B1/006
- H04B1/10
- CPC H04B1/04
- H04R17/02
- B81B7/00
- B81C1/00
- CPC H04R17/02