18368771. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Chul Seung Lee of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18368771 titled 'MULTILAYER ELECTRONIC COMPONENT
Simplified Explanation
The multilayer electronic component described in the abstract includes external electrodes with specific glass content in each layer to prevent cracks and improve moisture resistance reliability.
- The first external electrode consists of a 1-2-th electrode layer with glass and a 1-3-th electrode layer, while the second external electrode includes a 2-2-th electrode layer with glass and a 2-3-th electrode layer.
- The glass content in the electrode layers must meet certain criteria: S1-2≥15%, S1-2≥S1-3, S2-2≥15%, and S2-2>S2-3.
- By satisfying these conditions, the component can prevent cracks and enhance its resistance to moisture, improving overall reliability.
Potential Applications
The technology can be applied in various electronic devices where moisture resistance and reliability are crucial, such as sensors, actuators, and communication devices.
Problems Solved
This technology addresses the issue of cracking in multilayer electronic components, which can occur due to moisture exposure, leading to decreased reliability and performance.
Benefits
The benefits of this technology include improved moisture resistance reliability, reduced risk of cracks, and enhanced overall performance of electronic components.
Potential Commercial Applications
The technology can be utilized in the manufacturing of electronic components for consumer electronics, automotive systems, medical devices, and industrial equipment, among other applications.
Possible Prior Art
Prior art in the field of multilayer electronic components may include similar approaches to improving moisture resistance and reliability, but the specific criteria for glass content in each electrode layer as described in this patent application may be a novel innovation.
Unanswered Questions
How does this technology compare to existing methods for improving moisture resistance in electronic components?
This article does not provide a direct comparison with other methods or technologies used to enhance moisture resistance in electronic components. Further research or testing may be needed to evaluate the effectiveness of this approach in comparison to existing methods.
What are the potential limitations or challenges in implementing this technology in mass production?
The article does not address any potential limitations or challenges that may arise when implementing this technology on a larger scale for mass production. Factors such as cost, scalability, and compatibility with existing manufacturing processes could be important considerations that are not covered in the provided information.
Original Abstract Submitted
A multilayer electronic component, in which a first external electrode may include a 1-2-th electrode layer including glass, and a 1-3-th electrode layer disposed on the first and second surfaces and a second external electrode may include a 2-2-th electrode layer including glass, and a 2-3-th electrode layer disposed on the first and second surfaces. In cross sections of the first and second external electrodes in the first and second directions, when an area fraction occupied by glass in the 1-2-th electrode layer is S1-2, an area fraction occupied by glass in the 1-3-th electrode layer is S1-3, an area fraction occupied by glass in the 2-2-th electrode layer is S2-2, and an area fraction occupied by glass in the 2-3-th electrode layer is S2-3, S1-2≥15%, S1-2≥S1-3, S2-2≥15%, S2-2>S2-3 are satisfied, thereby preventing cracks and improving moisture resistance reliability.