Murata Manufacturing Co., Ltd. patent applications on April 10th, 2025
Patent Applications by Murata Manufacturing Co., Ltd. on April 10th, 2025
Murata Manufacturing Co., Ltd.: 18 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H01C7/04 (2), C25D17/12 (2), C25D21/10 (2), C25D17/00 (2), H01F27/28 (2) C25D17/02 (1), H01M4/62 (1), H05K1/0283 (1), H04N23/555 (1), H04B1/04 (1)
With keywords such as: portion, electrode, surface, plating, direction, layer, part, end, connected, and stretchable in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
20250116024. PLATING APPARATUS_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tomokazu SHIMADA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): C25D17/02, C25D17/00, C25D17/12, C25D21/10
CPC Code(s): C25D17/02
Abstract: a plating apparatus includes a plating bath storing a plating solution and plating targets, and an injector in the plating bath. the injector includes a first injection port to inject the plating solution. the plating targets included in the plating solution are stirred by the plating solution injected from the injector. a mesh portion is provided at the first injection port. the mesh portion is defined by at least two stacked meshes. the mesh portion includes a central portion and a circumferential portion provided outside the central portion when viewed in a planar direction. the circumferential portion is defined by one layer of the mesh or a plurality of layers of the mesh. the central portion is defined by a plurality of layers of the mesh. a number of layers of the mesh in the central portion is greater than that of the circumferential portion.
20250116025. PLATING APPARATUS_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tomokazu SHIMADA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): C25D17/22, C25D5/08, C25D17/12
CPC Code(s): C25D17/22
Abstract: a plating apparatus includes a plating bath in which a plating solution is stored, a metal pipe having a cylindrical shape and including a hollow portion, the metal pipe defining and functioning as a first electrode, a mesh pipe having a cylindrical shape and including a hollow portion, the mesh pipe being made of an insulating material, and a second electrode. the metal pipe, the mesh pipe, and the second electrode are accommodated in the plating bath, the metal pipe is located inside the hollow portion of the mesh pipe, a plating forming portion is provided between an inside of the mesh pipe and an outside of the metal pipe, the second electrode is located outside the mesh pipe, and an upward flow with which the plating solution is moved upward is generated inside the hollow portion of the metal pipe.
20250116029. PLATING APPARATUS_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tomokazu SHIMADA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): C25D21/10, C25D17/00
CPC Code(s): C25D21/10
Abstract: a plating apparatus includes a plating bath in which a plating solution including plating targets is stored and an injector that is in the plating bath and that injects the plating solution. the plating targets included in the plating solution are stirred by the plating solution injected from the injector. the injector has an inner cylindrical shape including a bottom surface extending in a horizontal direction, an inner wall extending in a height direction from the bottom surface, and an opening defined in an upper end of the inner wall. the opening is a first injection port that injects the plating solution to the plating bath. a mesh portion is provided at the first injection port. a second injection port that injects the plating solution to the injector is provided in the bottom surface.
20250117621. RFID MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Noriyuki UEKI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): G06K19/077, H01F27/28, H01F27/29
CPC Code(s): G06K19/07749
Abstract: an rfid module is provided that includes a substrate having a first main surface and a second main surface, an rfic chip disposed on the first main surface of the substrate, and a coil element having a conductive wire having a plurality of windings. a first end of the rfic chip is electrically connected to a first end of the coil element. a second end of the rfic chip is electrically connected to a second end of the coil element. the coil element has at least one sparsely wound portion, and both ends of the coil element are first densely wound portions in which the conductive wire is wound at a narrower pitch than the pitch in the sparsely wound portion.
Inventor(s): Daisho TSUBOKAWA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Tomoya OOSHIMA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yuuta HOSHINO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01C1/034, C03C1/00, H01C1/142, H01C7/04, H01C17/02, H01C17/28
CPC Code(s): H01C1/034
Abstract: an electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. the protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. the protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.
20250118462. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tomoya OOSHIMA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yuuta HOSHINO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01C7/04
CPC Code(s): H01C7/04
Abstract: an electronic component includes a base body and a glass film covering an outer surface of the base body. the glass film has a groove extending on an outer surface of the glass film. the groove is recessed from the outer surface of the glass film toward the outer surface side of the base body in a specific section in a direction orthogonal to the outer surface of the glass film. the bottom portion of the groove is located closer to the outer surface side of the glass film than the outer surface of the base body. in addition, the bottom portion of the groove has an arc shape in the specific section.
Inventor(s): Yukinobu MASUDA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Shigeto YAMAMOTO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Shingo NAKAMOTO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Kaori TAKEZAWA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01F27/28, H01F27/29
CPC Code(s): H01F27/2823
Abstract: a coil component comprises a first wire including a winding portion wound around a winding core portion of a core, a first end portion electrically connected to a terminal electrode provided in a first flange portion, and a first extended portion connecting the winding portion and the first end portion. in a first direction, the first end portion is positioned on a first side with respect to a central axis of the winding core portion, and a first boundary portion which is a boundary portion between the first extended portion and the winding portion is positioned on a second side with respect to the central axis. a corner of the winding core portion is positioned between the first boundary portion and the first end portion in a circumferential direction. a gap is interposed between the first extended portion and the corner.
20250118497. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Kazuhiro NISHIBAYASHI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yuki KOYAMA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/012, H01G4/12, H01G4/232
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes a multilayer body including dielectric layers and first and second inner electrode layers. the first inner electrode layers include first counter electrode portions facing the second inner electrode layers and first extended portions extending from the first counter electrode portions to a first end surface. the second inner electrode layers include a second counter electrode portions opposing the first inner electrode layers and second extended portions extending from the second counter electrode portions to a first side surface. the first extended portions include a first connection portion connected to straddle at least two or more of the first extended portions in the lamination direction, between the first extended portions, and the second extended portions include a second connection portion connected to straddle at least two or more of the second extended portions in the lamination direction, between the second extended portions.
20250118659. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takaaki MIZUNO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Toshiyuki NAKAISO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Kenji TOYOSHIMA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yoshimasa YOSHIOKA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01L23/522, H01L21/768, H10D1/20, H10D1/68
CPC Code(s): H01L23/5227
Abstract: an electronic component is provided that includes a substrate, an insulator layer, an inductor in the insulator layer, planar conductors extending along the substrate, and connecting conductors electrically connected to the planar conductors. the inductor includes surface direction conductors and a plurality of inductor via conductors that connect the surface direction conductors. a direction of a current flowing through an inductor via conductor among the plurality of inductor via conductors configuring a portion of a helical coil having a winding axis along the surface of the substrate, the inductor via conductor being adjacent to the connecting conductors, and a direction of a current flowing through the connecting conductors are opposite to each other.
Inventor(s): Nobuhiro INOUE of Kyoto JP for murata manufacturing co., ltd.
IPC Code(s): H01M4/62, H01M4/02, H01M4/133, H01M10/0525, H01M10/42
CPC Code(s): H01M4/62
Abstract: the secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. the negative electrode includes a negative electrode active material layer. the negative electrode active material layer includes an alkali metal carbonic acid compound and a magnesium compound. the alkali metal carbonic acid compound has a carbonate bond (—oc(═o)o—), and includes an alkali metal element as a constituent element. the magnesium compound includes magnesium as a constituent element.
Inventor(s): Masashi SATO of Kyoto JP for murata manufacturing co., ltd., Hiroyuki ITO of Kyoto JP for murata manufacturing co., ltd.
IPC Code(s): H01M50/528, H01M50/548
CPC Code(s): H01M50/528
Abstract: a battery unit is provided and includes a battery and a wiring unit. the battery includes an outer package can that includes a first surface on which a first electrode terminal is exposed, a second surface on which a second electrode terminal is exposed, and a side surface coupling the first surface and the second surface to each other. the second surface is disposed on a side opposite to the first surface. the wiring unit includes a first coupling terminal to be welded to the first electrode terminal, a second coupling terminal to be welded to the second electrode terminal, and a flexible wiring substrate. the flexible wiring substrate includes a first support part, a second support part, a middle part, a first wire, and a second wire. the first support part supports the first coupling terminal. the second support part supports the second coupling terminal. the middle part couples the first support part and the second support part to each other. the first wire extends from the first coupling terminal, through the first support part, to the middle part. the second wire extends from the second coupling terminal, through the second support part, to the middle part.
Inventor(s): Kentaro KAWABE of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01Q9/04, H01Q1/48
CPC Code(s): H01Q9/0414
Abstract: a first radiation conductor layer is provided in a multilayer body. a second radiation conductor layer is provided in or on the multilayer body, is located above the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in an up-down direction. a first floating conductor has a shape surrounding at least a part of a periphery of the first radiation conductor layer when viewed in the up-down direction, is located on a same layer as or above the first radiation conductor layer and on a same layer as or below the second radiation conductor layer in the up-down direction, and is not electrically connected to any conductor present in or on the multilayer body. a second floating conductor has a shape surrounding at least a part of a periphery of the second radiation conductor layer.
20250119114. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Katsuya DAIMON of Nagaokakyo-shi JP for murata manufacturing co., ltd., Sho NAGATOMO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H03H9/13, H03H9/02, H03H9/17
CPC Code(s): H03H9/132
Abstract: an acoustic wave device includes a piezoelectric layer, a first comb-shaped electrode on the piezoelectric layer, including a first busbar and first electrode fingers, and connected to an input potential, a second comb-shaped electrode on the piezoelectric layer, including a second busbar and second electrode fingers interdigitated with the first electrode fingers, and connected to an output potential, and a reference potential electrode connected to a reference potential and including third electrode fingers on the piezoelectric layer aligned with the first and second electrode fingers, and a connection electrode connecting adjacent third electrode fingers. an order in which a first electrode finger, a second electrode finger, and a third electrode finger are arranged is such that, starting from the first electrode finger, the first electrode finger, the third electrode finger, the second electrode finger, and the third electrode finger define one period.
20250119169. RADIO FREQUENCY CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Satoshi TANAKA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Shinya HITOMI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Hirotsugu MORI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H04B1/04, H03F3/19, H04B1/16
CPC Code(s): H04B1/04
Abstract: a radio frequency circuit supports a first power class and a second power class whose maximum output power is lower than that of the first power class, and includes: a first power amplifier; and a variable load matching circuit connected to an output end of the first power amplifier. under a condition that the first power class is applied, a first power supply voltage is supplied to the first power amplifier, and a load impedance viewed from the first power amplifier is adjusted to a first impedance by the variable load matching circuit. under a condition that the second power class is applied, a second power supply voltage is supplied to the first power amplifier, and the load impedance viewed from the first power amplifier is adjusted to a second impedance by the variable load matching circuit.
Inventor(s): Shu HAMADA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Tetsuo KAWAKAMI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Hiroyuki DAI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H04N23/50, H04N23/56, H04N23/57
CPC Code(s): H04N23/555
Abstract: a distal-end structure of an endoscope includes an image sensor disposed in a distal-end portion of an insertion portion of the endoscope elongated in an axial direction d the image sensor is directed in the axial direction d toward a distal end of the insertion portion and is configured to capture an image. a light-emitting device is disposed in the distal-end portion and configured to emit light in the axial direction d toward the distal end. a connection member is disposed inside the distal-end portion and in which the image sensor and the light-emitting device are mounted. wires are connected to the connection member. the wires supply electricity for driving the image sensor and the light-emitting device from outside the endoscope, transmit driving signals, and also transmit captured image data to a control unit.
20250120012. STRETCHABLE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takayoshi OBATA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H05K1/02, H05K1/18
CPC Code(s): H05K1/0283
Abstract: a stretchable device that includes: a stretchable substrate having a main surface; an electronic component on the main surface of the stretchable substrate; a first stretchable wiring connected to the electronic component; and a second stretchable wiring connected to the first stretchable wiring. a first end portion in an extending direction of the first stretchable wiring is connected to the electronic component, and a second end portion in the extending direction of the first stretchable wiring is connected to a third end portion in the extending direction of the second stretchable wiring.
20250120021. STRETCHABLE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tadahiko MATSUMOTO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/02
Abstract: a stretchable device that includes: a stretchable substrate that has a first main surface and a second main surface and is stretchable, wherein the first main surface includes a first region and a second region, and the stretchable substrate is in a folded back configuration such that the first main surface is in an inner side of the stretchable device; and an electronic component on the first main surface of the stretchable substrate.
Murata Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Murata Manufacturing Co., Ltd.
- C25D17/02
- C25D17/00
- C25D17/12
- C25D21/10
- CPC C25D17/02
- Murata manufacturing co., ltd.
- C25D17/22
- C25D5/08
- CPC C25D17/22
- CPC C25D21/10
- G06K19/077
- H01F27/28
- H01F27/29
- CPC G06K19/07749
- H01C1/034
- C03C1/00
- H01C1/142
- H01C7/04
- H01C17/02
- H01C17/28
- CPC H01C1/034
- CPC H01C7/04
- CPC H01F27/2823
- H01G4/30
- H01G4/008
- H01G4/012
- H01G4/12
- H01G4/232
- CPC H01G4/30
- H01L23/522
- H01L21/768
- H10D1/20
- H10D1/68
- CPC H01L23/5227
- H01M4/62
- H01M4/02
- H01M4/133
- H01M10/0525
- H01M10/42
- CPC H01M4/62
- H01M50/528
- H01M50/548
- CPC H01M50/528
- H01Q9/04
- H01Q1/48
- CPC H01Q9/0414
- H03H9/13
- H03H9/02
- H03H9/17
- CPC H03H9/132
- H04B1/04
- H03F3/19
- H04B1/16
- CPC H04B1/04
- H04N23/50
- H04N23/56
- H04N23/57
- CPC H04N23/555
- H05K1/02
- H05K1/18
- CPC H05K1/0283
- H05K5/02
- CPC H05K5/02