18809756. METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 18809756 titled 'METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
A method of manufacturing a multilayer electronic component includes disposing first internal electrode patterns including a first main portion and a first convex portion, thicker than the first main portion, at a first gap, on a first dielectric green sheet, and forming a first sheet by applying a first dielectric paste to the first gap and the first internal electrode patterns, disposing second internal electrode patterns including a second main portion and a second convex portion, thicker than the second main portion, at a second gap, on a second dielectric green sheet, and forming a second sheet by applying a second dielectric paste to the second gap and the second internal electrode patterns, forming a laminated bar by alternately disposing the first sheet and the second sheet, forming a laminate by cutting the laminated bar, and forming an external electrode on the laminate.