18781000. MULTILAYER ELECTRONIC COMPONENT (Samsung Electro-Mechanics Co., Ltd.)
MULTILAYER ELECTRONIC COMPONENT
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 18781000 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.