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Category:CPC H05K1/0271
Pages in category "CPC H05K1/0271"
The following 76 pages are in this category, out of 76 total.
1
- 18367963. LOW STRESS THROUGH GLASS VIAS (TGVS) (Intel Corporation)
- 18372585. NANOTWIN LINER FOR THROUGH GLASS VIAS (Intel Corporation)
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation)
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION)
- 18443553. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18603099. STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18639363. CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18650918. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18734089. PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME (Samsung Electro-Mechanics Co., Ltd.)
- 18781453. DAMPING STRUCTURE (Apple Inc.)
- 18809368. ELECTRONIC DEVICE (InnoLux Corporation)
- 18825308. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
2
A
- Advanced Semiconductor Engineering, Inc. Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple inc. (20250071888). DAMPING STRUCTURE
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
- Apple Inc. patent applications on February 27th, 2025
- Avago Technologies International Sales Pte. Limited Patent Application Trends in 2025
I
- Industrial Technology Research Institute Patent Application Trends in 2025
- Innolux Corporation Patent Application Trends in 2024
- InnoLux Corporation Patent Application Trends in 2025
- Intel corporation (20250089156). LOW STRESS THROUGH GLASS VIAS (TGVS)
- Intel corporation (20250106982). NANOTWIN LINER FOR THROUGH GLASS VIAS
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Intel corporation (20250113434). THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- Intel Corporation patent applications on March 13th, 2025
- Intel Corporation patent applications on March 27th, 2025
K
L
M
- Micron technology, inc. (20240292522). MICROELECTRONIC DEVICE PACKAGE ASSEMBLIES INCLUDING STIFFENER DEVICES, AND RELATED MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS simplified abstract
- Micron Technology, Inc. Patent Application Trends in 2024
- Micron Technology, Inc. patent applications on August 29th, 2024
- Murata manufacturing co., ltd. (20240284591). CIRCUIT MODULE simplified abstract
- Murata Manufacturing Co., Ltd. Patent Application Trends in 2025
- Murata Manufacturing Co., Ltd. patent applications on August 22nd, 2024
- Murata Manufacturing Co., Ltd. patent applications on February 6th, 2025
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- Samsung electro-mechanics co., ltd. (20250126703). PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2025
- Samsung Electro-Mechanics Co., Ltd. patent applications on April 17th, 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240357737). SHOCK ABSORBER AND ELECTRONIC DEVICE HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250120009). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on April 10th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 10th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
T
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2025