METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION THEREOF

Abstract: substrates may be metallized by introducing a seed layer upon a base substrate, mechanically polishing the seed layer, and forming a metal layer upon the seed layer after mechanical polishing. the base substrate may comprise a ceramic, such as silicon nitride or aluminum nitride, a polymer, silicon, metal, or glass. the seed layer optionally may be rendered electrically conductive by mechanical polishing of an initially non-conductive seed layer. the metal layer may be formed by depositing a metal nanoparticle composition upon the seed layer after mechanical polishing and consolidating metal nanoparticles therein, such as through a hot pressing operation. the metal nanoparticle composition may contain one or more additives that facilitate cte matching of the metal layer to the base substrate.

Inventor(s): Alfred A. Zinn, Alex Capanzana, Hannah Thanh Zinn

CPC Classification: H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)

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