Apple inc. (20250071888). DAMPING STRUCTURE
DAMPING STRUCTURE
Organization Name
Inventor(s)
Shawn X. Arnold of Cupertion CA (US)
Zhongqing Gong of Fremont CA (US)
Anping Guo of San Jose CA (US)
DAMPING STRUCTURE
This abstract first appeared for US patent application 20250071888 titled 'DAMPING STRUCTURE
Original Abstract Submitted
the present disclosure describes a structure with a substrate, a damping structure, and a capacitor structure. the damping structure is disposed over the substrate and includes a rigid material layer and a damping material layer disposed on the rigid material layer. the damping material layer includes a damping material with a tensile strength of about 20 mpa, a young's modulus of about 0.5 gpa, and an elongation of about 10%. the capacitor structure is disposed over the damping structure, in which the damping structure mitigates (or eliminates) a transfer of piezoelectric and electrostrictive vibrations generated by the capacitor structure to the substrate.