TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2025
TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Filing Activity
TONG HSING ELECTRONIC INDUSTRIES, LTD. patent applications in 2025
File:TONG HSING ELECTRONIC INDUSTRIES, LTD. Monthly Patent Applications 2025 - Up to March 2025.png
Top 10 Technology Areas
TONG HSING ELECTRONIC INDUSTRIES, LTD. Top Technology Areas 2025 - Up to March 2025
- H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 3 patents
- Example: 20250079267. CHIP PACKAGE STRUCTURE (TONG HSING ELECTRONIC INDUSTRIES, LTD.)
- H01L27/14618 ({Containers})
- H01L27/14636 ({Interconnect structures})
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- B23K35/3006 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K1/09 (Use of materials for the {conductive, e.g. } metallic pattern)
- H05K3/4038 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2201/0338 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2201/09509 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
Emerging Technology Areas
TONG HSING ELECTRONIC INDUSTRIES, LTD. Top Emerging Technology Areas 2025 - Up to March 2025
- H10H20/0364 (No explanation available)
- H10H20/0362 (No explanation available)
- H10H20/853 (No explanation available)
- H10H20/857 (No explanation available)
- B23K35/286 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
- B23K35/0238 (characterised by mechanical features, e.g. shape)
- H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- B32B2311/12 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B32B2311/08 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)
- B23K2103/52 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal)
Top Inventors
TONG HSING ELECTRONIC INDUSTRIES, LTD. Top Inventors 2025 - Up to March 2025
- SHIH-HAN WU (3 patents)
- JHIH-WEI LAI (3 patents)
- JIAN-YU SHIH (3 patents)
- LI-CHUN HUNG (2 patents)
- JIA-YI WU (2 patents)
- YAN-WEI CHEN (2 patents)
- MING-YEN PAN (2 patents)
- CHIH-WEI MAO (2 patents)
- TSUNG-YING CHANG (2 patents)
- CHUNG-HO WEI (2 patents)
Patent Categories
TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Categories 2025 - Up to March 2025
Geographical Distribution of Inventors
TONG HSING ELECTRONIC INDUSTRIES, LTD. Inventor Countries 2025 - Up to March 2025
Geographical Distribution of US Inventors
TONG HSING ELECTRONIC INDUSTRIES, LTD. Inventor States 2025 - Up to March 2025
Categories:
- Pages with broken file links
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Companies
- CPC H05K1/0271
- CPC H05K1/09
- CPC H05K3/4038
- CPC H05K2201/0338
- CPC H05K2201/09509
- CPC H05K2201/09563
- CPC H01L27/14618
- CPC H01L23/562
- CPC H01L23/585
- CPC H01L27/14636
- CPC B32B9/005
- CPC B32B3/06
- CPC B32B3/10
- CPC B32B15/043
- CPC B32B15/20
- CPC B32B38/0012
- CPC B32B38/162
- CPC B32B2307/538
- CPC B32B2310/14
- CPC H01L27/14625
- CPC H01L27/14685
- CPC C04B35/581
- CPC C04B35/62218
- CPC C04B35/6261
- CPC C04B35/638
- CPC C04B35/64
- CPC C04B2235/3225
- CPC C04B2235/386
- CPC C04B2235/3865
- CPC C04B2235/528
- CPC C04B2235/5292
- CPC C04B2235/5436
- CPC C04B2235/5445
- CPC C04B2235/5454
- CPC C04B2235/6025
- CPC C04B2235/604
- CPC C04B2235/612
- CPC C04B2235/6581
- CPC C04B2235/667
- CPC C04B2235/668
- CPC C04B2235/78
- CPC H01L23/4951
- CPC H01L23/4952
- CPC H01L23/49568
- CPC H01L24/08
- CPC H01L24/16
- CPC H01L25/0657
- CPC H01L2224/08145
- CPC H01L2224/08245
- CPC H01L2224/16147
- CPC H01L2224/16227
- CPC H01L2225/06517
- CPC H01L2924/01029
- CPC H01L2924/014
- CPC H01L23/49822
- CPC H01L23/49838
- CPC H01L24/32
- CPC H01L25/072
- CPC H01L2224/08168
- CPC H01L2224/32157
- CPC H01L2224/32238
- CPC H01L2924/13055
- CPC H01L2924/13091
- CPC H01L23/15
- CPC H01L23/3121
- CPC H01L23/36
- CPC H01L23/49805
- CPC H01L23/49811
- CPC H01L23/49833
- CPC H01L2224/08258
- CPC H01L2224/32112
- CPC H05K3/12
- CPC H05K1/18
- CPC H05K2201/10984
- CPC B23K1/0016
- CPC B23K35/025
- CPC B23K35/3006
- CPC B23K35/302
- CPC B32B15/04
- CPC B23K2101/36
- CPC B23K2103/52
- CPC B32B2311/08
- CPC B32B2311/12
- CPC H01L23/3735
- CPC B23K35/0238
- CPC B23K35/286
- CPC H10H20/857
- CPC H10H20/853
- CPC H10H20/0362
- CPC H10H20/0364
- Patent Trends by Company in 2025