WIRING BOARD

Abstract: a wiring board according to the present disclosure includes a first insulation layer, a first laminate portion, a second laminate portion, a second insulation layer, a third insulation layer, a first mounting region, a second mounting region, a first electrical conductor layer having a planar shape, a second electrical conductor layer, and a solder resist having an opening from which a part of the first electrical conductor layer is exposed. in a plane perspective view, in a frame-shaped region between an outer peripheral edge of the first mounting region and an outer peripheral edge of the second mounting region, a through-hole conductor that connects the first electrical conductor layer and the second electrical conductor layer is located across the edge of the opening.

Inventor(s): Suguru KADOWAKI, Tomoko NAKAMURA

CPC Classification: H05K1/0271 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)

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