Murata manufacturing co., ltd. (20240284591). CIRCUIT MODULE simplified abstract
CIRCUIT MODULE
Organization Name
murata manufacturing co., ltd.
Inventor(s)
Tsuyoshi Takakura of Kyoto (JP)
Masaaki Mizushiro of Kyoto (JP)
Hiroki Yoshimori of Kyoto (JP)
Yoshihito Otsubo of Kyoto (JP)
CIRCUIT MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240284591 titled 'CIRCUIT MODULE
Simplified Explanation
The circuit module described in the patent application includes a substrate with a resin layer, an electronic component, and conductors penetrating the resin layer.
- The substrate has two main surfaces, with the resin layer on one surface.
- The electronic component is integrated into the circuit module.
- The conductors include a pillar conductor and a metal film covering part of it.
Key Features and Innovation
- Substrate with resin layer for protection and insulation.
- Pillar conductor for efficient signal transmission.
- Metal film conductor for additional conductivity and protection.
Potential Applications
The technology can be used in various electronic devices such as smartphones, tablets, and computers.
Problems Solved
- Improved signal transmission efficiency.
- Enhanced protection for electronic components.
- Increased conductivity for better performance.
Benefits
- Higher reliability of electronic devices.
- Improved performance and durability.
- Enhanced signal quality.
Commercial Applications
- The technology can be applied in the consumer electronics industry for better-performing devices with increased durability and reliability.
Questions about the Technology
What are the potential applications of this circuit module technology?
The potential applications of this technology include its use in various electronic devices such as smartphones, tablets, and computers for improved performance and reliability.
How does the pillar conductor contribute to the efficiency of signal transmission in the circuit module?
The pillar conductor in the circuit module provides a direct and efficient path for signal transmission, reducing signal loss and improving overall performance.
Original Abstract Submitted
a circuit module includes: a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor that is a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor that is a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to the same plane with the outer surface of the resin layer.