Samsung electronics co., ltd. (20250120009). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Jonghyeon Chang of Suwon-si KR
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250120009 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a base substrate including a lower surface; a semiconductor chip on the base substrate; and a plurality of connection bumps on the lower surface of the base substrate, wherein the plurality of connection bumps includes a first group including connection bumps arranged on the lower surface in a first direction, and a second group including connection bumps arranged on the lower surface in a second direction, the second direction having a first angle with respect to the first direction, the connection bumps of the first group are offset from each other in the first direction, and the connection bumps of the second group are offset from each other in the second direction.