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Category:CPC H01L21/76897
Pages in category "CPC H01L21/76897"
The following 95 pages are in this category, out of 95 total.
1
- 18065060. BACKSIDE DIRECT CONTACT FORMATION simplified abstract (International Business Machines Corporation)
- 18065965. SELF-ALIGNED BACKSIDE GATE CONTACTS simplified abstract (International Business Machines Corporation)
- 18109365. ELECTRONIC DEVICE FABRICATION USING AREA-SELECTIVE DEPOSITION simplified abstract (Applied Materials, Inc.)
- 18122680. FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH simplified abstract (International Business Machines Corporation)
- 18141313. BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18166403. SELF-ALIGNED SMALL CONTACT STRUCTURE simplified abstract (QUALCOMM Incorporated)
- 18471408. SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS (International Business Machines Corporation)
- 18507019. APPARATUS WITH SELF-ALIGNED CONNECTION AND RELATED METHODS simplified abstract (Micron Technology, Inc.)
- 18606335. INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18652803. SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18653815. GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME simplified abstract (Intel Corporation)
- 18657243. SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18751841. METHODS FOR FORMING SELF-ALIGNED INTERCONNECT STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18968821. DIELECTRIC CAP STRUCTURE IN SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19001094. SELF-ALIGNED VIA FORMATION USING SPACERS (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
2
- 20250183098. Semiconductor Device Including C (SK hynix .)
- 20250218868. Self-aligned Interconnect Fe (Intel)
- 20250218869. Self-aligned Back-side Gate (Intel)
- 20250218870. Self-aligning Backside (Applied Materials, .)
- 20250233019. Multi-level Selective Patterni (Geminatio, .)
- 20250233020. Gate Contact Structure Over (Intel)
A
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
- Apple Patent Application Trends in 2024
- Applied materials, inc. (20240282632). ELECTRONIC DEVICE FABRICATION USING AREA-SELECTIVE DEPOSITION simplified abstract
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on August 22nd, 2024
I
- IMEC VZW Patent Application Trends in 2024
- Intel corporation (20240282633). GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME simplified abstract
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on August 22nd, 2024
- International business machines corporation (20240194528). BACKSIDE DIRECT CONTACT FORMATION simplified abstract
- International business machines corporation (20240203792). SELF-ALIGNED BACKSIDE GATE CONTACTS simplified abstract
- International business machines corporation (20240290657). SELF-ALIGNED CONTACT BASED VIA TO BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240312839). FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH simplified abstract
- International business machines corporation (20240429096). GATE CUT OF SELF-ALIGNED CONTACT POST REPLACEMENT METAL GATE
- International business machines corporation (20240429097). SELF-ALIGNED BACKSIDE CONTACT
- International business machines corporation (20240429098). MERGED SELF-ALIGNED BACKSIDE CONTACT
- International business machines corporation (20250105061). SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on August 29th, 2024
- International Business Machines Corporation patent applications on December 26th, 2024
- International Business Machines Corporation patent applications on June 13th, 2024
- International Business Machines Corporation patent applications on June 20th, 2024
- International Business Machines Corporation patent applications on March 27th, 2025
- International Business Machines Corporation patent applications on September 19th, 2024
M
Q
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240203793). BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
T
- Tahoe Research, Ltd. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250096043). DIELECTRIC CAP STRUCTURE IN SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240258168). Self Aligned Contact Scheme
- Taiwan semiconductor manufacturing company, ltd. (20240258168). Self Aligned Contact Scheme simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266218). INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297076). SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321637). SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347384). METHODS FOR FORMING SELF-ALIGNED INTERCONNECT STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379434). Fully Self-Aligned Interconnect Structure simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379435). SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379436). SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250132204). SELF-ALIGNED VIA FORMATION USING SPACERS
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 24th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024