18141313. BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING
Organization Name
Inventor(s)
Tae Sun Kim of Ballston Spa NY (US)
Wonhyuk Hong of Clifton Park NY (US)
Jongjin Lee of Clifton Park NY (US)
Buhyun Ham of Mechanicville NY (US)
Kang-ill Seo of Springfield VA (US)
BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18141313 titled 'BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING
Simplified Explanation
This patent application describes a method to improve the quality of contact for backside power distribution networks in semiconductor devices by introducing a backside contact with a positive slope and a dielectric sidewall liner.
Key Features and Innovation
- Backside contact with a positive slope
- Dielectric sidewall liner for improved contact quality
- Methods for manufacturing the backside contact
Potential Applications
This technology can be applied in the semiconductor industry for improving the efficiency and performance of power distribution networks in devices.
Problems Solved
This technology addresses the issue of achieving higher contact quality in backside power distribution networks, which is crucial for the overall performance of semiconductor devices.
Benefits
- Enhanced contact quality
- Improved efficiency of power distribution networks
- Better performance of semiconductor devices
Commercial Applications
- Semiconductor manufacturing industry
- Electronics industry
- Power distribution sector
Questions about the Technology
What are the potential applications of this technology in other industries?
This technology can potentially be applied in various industries beyond semiconductors for improving contact quality in different types of electronic devices.
How does the positive slope of the backside contact contribute to better contact quality?
The positive slope of the backside contact helps in ensuring a more secure and stable connection, leading to improved overall performance of the semiconductor device.
Original Abstract Submitted
In order to achieve higher contact quality for backside power distribution networks, provided is a backside contact to a semiconductor device having a positive slope and a dielectric sidewall liner, and methods for making the same.