Category:Nicholas Anthony Lanzillo of Wynantskill NY (US)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
Executive Summary
Nicholas Anthony Lanzillo of Wynantskill NY (US) is an inventor who has filed 12 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), {Geometry or} layout of the interconnection structure {( (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as INTERNATIONAL BUSINESS MACHINES CORPORATION (8 patents), International Business Machines Corporation (4 patents). Their most frequent collaborators include (10 collaborations), (5 collaborations), (5 collaborations).
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
- H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 4 patents
- H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 2 patents
- H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/76897 ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step (self-aligned silicidation on field effect transistors): 2 patents
- H10D30/43 (No explanation available): 2 patents
- H10D30/6735 (No explanation available): 2 patents
- H10D62/121 (No explanation available): 2 patents
- H01L21/76886 ({Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances}): 1 patents
- H01L21/768 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
- H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
- H01L21/76831 ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
- H01L21/76885 ({By forming conductive members before deposition of protective insulating material, e.g. pillars, studs}): 1 patents
- H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/3065 (Plasma etching; Reactive-ion etching): 1 patents
- H01L21/76816 ({Aspects relating to the layout of the pattern or to the size of vias or trenches (layout of the interconnections per se): 1 patents
- H01L23/5256 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
- H10D30/6757 (No explanation available): 1 patents
- H10D64/251 (No explanation available): 1 patents
- H10D84/83 (No explanation available): 1 patents
- H01L21/7682 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
- H01L21/76838 ({characterised by the formation and the after-treatment of the conductors (etching for patterning the conductors): 1 patents
- H01L29/41766 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L27/0928 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
- H10D30/014 (No explanation available): 1 patents
- H10D30/6729 (No explanation available): 1 patents
- H10D64/017 (No explanation available): 1 patents
- H10D84/0167 (No explanation available): 1 patents
- H10D84/017 (No explanation available): 1 patents
- H10D84/0186 (No explanation available): 1 patents
- H10D84/038 (No explanation available): 1 patents
- H10D84/856 (No explanation available): 1 patents
- H10D88/01 (No explanation available): 1 patents
Companies
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List of Companies
- INTERNATIONAL BUSINESS MACHINES CORPORATION: 8 patents
- International Business Machines Corporation: 4 patents
Collaborators
- Ruilong Xie of Niskayuna NY (US) (10 collaborations)
- Lawrence A. Clevenger of Saratoga Springs NY (US) (5 collaborations)
- Reinaldo Vega of Mahopac NY (US) (5 collaborations)
- Koichi Motoyama of Clifton Park NY (US) (4 collaborations)
- Brent A. Anderson of Jericho VT (US) (4 collaborations)
- Albert M. Chu of Nashua NH (US) (4 collaborations)
- James P. Mazza of Saratoga Springs NY (US) (4 collaborations)
- Takashi Ando of Eastchester NY (US) (3 collaborations)
- David Wolpert of Poughkeepsie NY (US) (3 collaborations)
- Chih-Chao Yang of Glenmont NY (US) (1 collaborations)
- Tao Li of Slingerlands NY (US) (1 collaborations)
- Dan Moy of Bethel CT (US) (1 collaborations)
- JENS HAETTY of Halfmoon NY (US) (1 collaborations)
- Christopher Murphy of Red Hook NY (US) (1 collaborations)
- Huai Huang of Clifton Park NY (US) (1 collaborations)
- Hosadurga Shobha of Niskayuna NY (US) (1 collaborations)
- Atharv Jog of Albany NY (US) (1 collaborations)
- Shahrukh Khan of Sandy Hook CT (US) (1 collaborations)
- Biswanath Senapati of Mechanicville NY (US) (1 collaborations)
- Utkarsh Bajpai of Delmar NY (US) (1 collaborations)
- Tenko Yamashita of Schenectady NY (US) (1 collaborations)
- John Christopher Arnold of North Chatham NY (US) (1 collaborations)
- Chen Zhang of Santa Clara CA (US) (1 collaborations)
- Terence B. Hook of Jericho Center VT (US) (1 collaborations)
- Junli Wang of Slingerlands NY (US) (1 collaborations)
Subcategories
This category has the following 7 subcategories, out of 7 total.
A
B
C
L
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Pages in category "Nicholas Anthony Lanzillo of Wynantskill NY (US)"
The following 146 pages are in this category, out of 146 total.
1
- 17454378. DAMASCENE INTERCONNECT SPACER TO FACILITATE GAP FILL simplified abstract (International Business Machines Corporation)
- 17524107. INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETCH PROCESSING simplified abstract (International Business Machines Corporation)
- 17532310. PARTIAL SUBTRACTIVE SUPERVIA ENABLING HYPER-SCALING simplified abstract (International Business Machines Corporation)
- 17542563. SAM FORMULATIONS AND CLEANING TO PROMOTE QUICK DEPOSITIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17543964. BEOL INTERCONNECT SUBTRACTIVE ETCH SUPER VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17546682. BARRIER LINER FREE INTERFACE FOR METAL VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17547669. DOPANT-FREE INHIBITOR FOR AREA SELECTIVE DEPOSITIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17551428. LINER-FREE RESISTANCE CONTACTS AND SILICIDE WITH SILICIDE STOP LAYER simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17551457. MEMORY CELL IN WAFER BACKSIDE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17808116. POWER PLANES AND PASS-THROUGH VIAS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17808316. INTERCONNECT WITH TWO-DIMENSIONAL FREE ZERO LINE END ENCLOSURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17837434. SKIP-LEVEL TSV WITH HYBRID DIELECTRIC SCHEME FOR BACKSIDE POWER DELIVERY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17896278. Barrier-Less Jumper Structure for Line-to-Line Connections simplified abstract (International Business Machines Corporation)
- 17931145. A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17931767. INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE TYPES OF BACKSIDE TO FRONTSIDE VIAS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17932327. POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT simplified abstract (International Business Machines Corporation)
- 17933078. NON-PLANAR METAL-INSULATOR-METAL STRUCTURE simplified abstract (International Business Machines Corporation)
- 17933874. HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CONNECTIONS simplified abstract (International Business Machines Corporation)
- 17934195. SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT simplified abstract (International Business Machines Corporation)
- 17936434. VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN CONNECTIONS simplified abstract (International Business Machines Corporation)
- 17943799. LINE EXTENSION FOR SKIP-LEVEL VIA LANDING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17945498. VTFET CIRCUIT WITH OPTIMIZED OUTPUT simplified abstract (International Business Machines Corporation)
- 17956114. SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS simplified abstract (International Business Machines Corporation)
- 17956334. MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER simplified abstract (International Business Machines Corporation)
- 17957599. VTFETS WITH WRAP-AROUND BACKSIDE CONTACTS simplified abstract (International Business Machines Corporation)
- 17961281. Backside BPR/BSPDN Intergration with Backside Local Interconnect. simplified abstract (International Business Machines Corporation)
- 17963281. SKIP VIA WITH LATERAL LINE CONNECTION simplified abstract (International Business Machines Corporation)
- 17969260. Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17969773. SELF-ALIGNED ZERO TRACK SKIP simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17986276. BACKSIDE SKIP-LEVEL THROUGH VIA FOR BACKSIDE SIGNAL LINE CONNECTION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18048877. ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18049297. SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18054187. METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18054991. AIRGAP SPACER FOR POWER VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18059098. ADJACENT BURIED POWER RAIL FOR STACKED FIELD-EFFECT TRANSISTOR ARCHITECTURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18060168. ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18060544. BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18062624. POWER TAP CELL FOR FRONT SIDE POWER RAIL CONNECTION TO BSPDN simplified abstract (International Business Machines Corporation)
- 18065120. SUPER VIA WITH SIDEWALL SPACER simplified abstract (International Business Machines Corporation)
- 18065195. NEGATIVE CAPACITANCE FOR FERROELECTRIC CAPACITIVE MEMORY CELL simplified abstract (International Business Machines Corporation)
- 18065663. LOW RESISTANCE METALIZATION FOR CONNECTING A VERTICAL TRANSPORT FET SINGLE-CPP INVERTER simplified abstract (International Business Machines Corporation)
- 18065747. SKIP VIA WITH DISCONTINUOUS DIELECTRIC CAP simplified abstract (International Business Machines Corporation)
- 18066243. CONTACT STRUCTURE FOR POWER DELIVERY ON SEMICONDUCTOR DEVICE simplified abstract (International Business Machines Corporation)
- 18067148. HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract (International Business Machines Corporation)
- 18067748. SEMICONDUCTOR DEVICE WITH BACKSIDE U-SHAPED SILICIDE simplified abstract (International Business Machines Corporation)
- 18068123. SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT simplified abstract (International Business Machines Corporation)
- 18069077. VERTICAL FIELD EFFECT TRANSISTOR WITH SELF-ALIGNED BACKSIDE TRENCH EPITAXY simplified abstract (International Business Machines Corporation)
- 18069213. DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POWERVIA TRENCH simplified abstract (International Business Machines Corporation)
- 18069769. RESISTIVE RANDOM ACCESS MEMORY ON A BURIED BITLINE simplified abstract (International Business Machines Corporation)
- 18078454. SEMICONDUCTOR STRUCTURE WITH BACKSIDE METALLIZATION LAYERS simplified abstract (International Business Machines Corporation)
- 18079079. CIRCUIT LAYOUTS WITH VARIABLE CIRCUIT CELL HEIGHTS IN THE SAME CIRCUIT ROW simplified abstract (International Business Machines Corporation)
- 18081795. STACKED VERTICAL-TRANSPORT FIELD EFFECT TRANSISTORS (VTFETs) simplified abstract (International Business Machines Corporation)
- 18083818. FLEXIBLE MOL AND/OR BEOL STRUCTURE simplified abstract (International Business Machines Corporation)
- 18086229. VTFET CIRCUIT WITH OPTIMIZED MOL simplified abstract (International Business Machines Corporation)
- 18092126. CELL-BASED SIGNAL CONNECTIVITY BETWEEN WAFER FRONTSIDE AND BACKSIDE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18093713. VIA STRUCTURE WITHOUT LINER INTERFACE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18123613. BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18133304. METAL FERROELECTRIC INSULATOR METAL STACK IN RRAM simplified abstract (International Business Machines Corporation)
- 18145059. VTFET CELL BOUNDARY HAVING AN IN-LINE CONTACT simplified abstract (International Business Machines Corporation)
- 18156024. FORMING WRAP AROUND CONTACT WITH SELF-ALIGNED BACKSIDE CONTACT simplified abstract (International Business Machines Corporation)
- 18158505. BACKSIDE CONTACT WITH CONTACT JUMPER FOR STACKED FET simplified abstract (International Business Machines Corporation)
- 18176551. SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18182412. SELF-ALIGNED VIA IN DOUBLE DIFFUSION BREAK TO CONNECT TO BACKSIDE INTERCONNECTS simplified abstract (International Business Machines Corporation)
- 18186236. BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18188042. STACKED LINEAR DOUBLE-LENGTH VTFETS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18211283. TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18298402. METAL CONTACT CONNECTION THROUGH DIFFUSION BREAK AREA simplified abstract (International Business Machines Corporation)
- 18333863. REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18334414. INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18334606. STRUCTURE FOR BACKSIDE SIGNAL AND POWER (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18335172. POWER DISTRIBUTION WITH BACKSIDE POWER PLANES (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18337318. STACKED DEVICES WITH BACKSIDE CONTACTS (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18345540. PITCH CHANGE BETWEEN METAL LINES (International Business Machines Corporation)
I
- International business machines corporation (20240096692). HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CONNECTIONS simplified abstract
- International business machines corporation (20240096786). SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT simplified abstract
- International business machines corporation (20240096793). NON-PLANAR METAL-INSULATOR-METAL STRUCTURE simplified abstract
- International business machines corporation (20240096794). VTFET CIRCUIT WITH OPTIMIZED OUTPUT simplified abstract
- International business machines corporation (20240096801). POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT simplified abstract
- International business machines corporation (20240105506). LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA simplified abstract
- International business machines corporation (20240105583). INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE simplified abstract
- International business machines corporation (20240105606). BACKSIDE POWER RAIL WITH TIGHT SPACE simplified abstract
- International business machines corporation (20240105608). LOCAL FRONTSIDE POWER RAIL WITH GLOBAL BACKSIDE POWER DELIVERY simplified abstract
- International business machines corporation (20240105610). VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE GATE CONTACT simplified abstract
- International business machines corporation (20240105841). VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTORS WITH HIGH PERFORMANCE OUTPUT simplified abstract
- International business machines corporation (20240113013). SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS simplified abstract
- International business machines corporation (20240113024). MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER simplified abstract
- International business machines corporation (20240113178). VTFETS WITH WRAP-AROUND BACKSIDE CONTACTS simplified abstract
- International business machines corporation (20240113219). VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN CONNECTIONS simplified abstract
- International business machines corporation (20240120256). Backside BPR/BSPDN Intergration with Backside Local Interconnect. simplified abstract
- International business machines corporation (20240120271). SKIP VIA WITH LATERAL LINE CONNECTION simplified abstract
- International business machines corporation (20240136253). ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract
- International business machines corporation (20240136281). SELF-ALIGNED ZERO TRACK SKIP simplified abstract
- International business machines corporation (20240136287). Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits simplified abstract
- International business machines corporation (20240136414). SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY simplified abstract
- International business machines corporation (20240162118). BACKSIDE SKIP-LEVEL THROUGH VIA FOR BACKSIDE SIGNAL LINE CONNECTION simplified abstract
- International business machines corporation (20240162139). METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract
- International business machines corporation (20240162152). AIRGAP SPACER FOR POWER VIA simplified abstract
- International business machines corporation (20240178050). ADJACENT BURIED POWER RAIL FOR STACKED FIELD-EFFECT TRANSISTOR ARCHITECTURE simplified abstract
- International business machines corporation (20240178127). ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract
- International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract
- International business machines corporation (20240186177). ASYMMETRIC SKIP-LEVEL VIA STRUCTURE simplified abstract
- International business machines corporation (20240186245). REDUCED CAPACITANCE BETWEEN POWER VIA BAR AND GATES simplified abstract
- International business machines corporation (20240194236). NEGATIVE CAPACITANCE FOR FERROELECTRIC CAPACITIVE MEMORY CELL simplified abstract
- International business machines corporation (20240194585). SUPER VIA WITH SIDEWALL SPACER simplified abstract
- International business machines corporation (20240194586). SEMICONDUCTOR STRUCTURE WITH BACKSIDE METALLIZATION LAYERS simplified abstract
- International business machines corporation (20240194601). POWER TAP CELL FOR FRONT SIDE POWER RAIL CONNECTION TO BSPDN simplified abstract
- International business machines corporation (20240194681). CIRCUIT LAYOUTS WITH VARIABLE CIRCUIT CELL HEIGHTS IN THE SAME CIRCUIT ROW simplified abstract
- International business machines corporation (20240203867). SKIP VIA WITH DISCONTINUOUS DIELECTRIC CAP simplified abstract
- International business machines corporation (20240203870). FLEXIBLE MOL AND/OR BEOL STRUCTURE simplified abstract
- International business machines corporation (20240203880). SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT simplified abstract
- International business machines corporation (20240203982). DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POWERVIA TRENCH simplified abstract
- International business machines corporation (20240203985). STACKED VERTICAL-TRANSPORT FIELD EFFECT TRANSISTORS (VTFETs) simplified abstract
- International business machines corporation (20240203993). LOW RESISTANCE METALIZATION FOR CONNECTING A VERTICAL TRANSPORT FET SINGLE-CPP INVERTER simplified abstract
- International business machines corporation (20240203996). HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract
- International business machines corporation (20240204063). SEMICONDUCTOR DEVICE WITH BACKSIDE U-SHAPED SILICIDE simplified abstract
- International business machines corporation (20240204067). CONTACT STRUCTURE FOR POWER DELIVERY ON SEMICONDUCTOR DEVICE simplified abstract
- International business machines corporation (20240204100). VERTICAL FIELD EFFECT TRANSISTOR WITH SELF-ALIGNED BACKSIDE TRENCH EPITAXY simplified abstract
- International business machines corporation (20240213244). VTFET CELL BOUNDARY HAVING AN IN-LINE CONTACT simplified abstract
- International business machines corporation (20240213252). VTFET CIRCUIT WITH OPTIMIZED MOL simplified abstract
- International business machines corporation (20240215266). RESISTIVE RANDOM ACCESS MEMORY ON A BURIED BITLINE simplified abstract
- International business machines corporation (20240220696). CELL-BASED SIGNAL CONNECTIVITY BETWEEN WAFER FRONTSIDE AND BACKSIDE simplified abstract
- International business machines corporation (20240234248). ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract
- International business machines corporation (20240234297). VIA STRUCTURE WITHOUT LINER INTERFACE simplified abstract
- International business machines corporation (20240234306). SELF-ALIGNED ZERO TRACK SKIP simplified abstract
- International business machines corporation (20240234316). Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits simplified abstract
- International business machines corporation (20240234523). SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY simplified abstract
- International business machines corporation (20240243128). FORMING WRAP AROUND CONTACT WITH SELF-ALIGNED BACKSIDE CONTACT simplified abstract
- International business machines corporation (20240250136). BACKSIDE CONTACT WITH CONTACT JUMPER FOR STACKED FET simplified abstract
- International business machines corporation (20240290713). PASS-THROUGH WIRING IN NOTCHED INTERCONNECT simplified abstract
- International business machines corporation (20240297167). SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES simplified abstract
- International business machines corporation (20240312912). SELF-ALIGNED VIA IN DOUBLE DIFFUSION BREAK TO CONNECT TO BACKSIDE INTERCONNECTS simplified abstract
- International business machines corporation (20240321687). BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT simplified abstract
- International business machines corporation (20240321747). BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS simplified abstract
- International business machines corporation (20240321879). STACKED LINEAR DOUBLE-LENGTH VTFETS simplified abstract
- International business machines corporation (20240332165). OFFSET VIA FORMATION FOR FLEXIBLE ROUTING simplified abstract
- International business machines corporation (20240347423). METAL CONTACT CONNECTION THROUGH DIFFUSION BREAK AREA simplified abstract
- International business machines corporation (20240349631). METAL FERROELECTRIC INSULATOR METAL STACK IN RRAM simplified abstract
- International business machines corporation (20240413084). STACKED FETs WITH BACKSIDE ANGLE CUT
- International business machines corporation (20240413085). STACKED TRANSISTORS WITH METAL VIAS
- International business machines corporation (20240421038). STACKED DEVICES WITH BACKSIDE CONTACTS
- International business machines corporation (20240421069). TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH
- International business machines corporation (20240421078). REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- International business machines corporation (20240421079). INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- International business machines corporation (20240421087). STRUCTURE FOR BACKSIDE SIGNAL AND POWER
- International business machines corporation (20240421088). POWER DISTRIBUTION WITH BACKSIDE POWER PLANES
Categories:
- Ruilong Xie of Niskayuna NY (US)
- Lawrence A. Clevenger of Saratoga Springs NY (US)
- Reinaldo Vega of Mahopac NY (US)
- Koichi Motoyama of Clifton Park NY (US)
- Brent A. Anderson of Jericho VT (US)
- Albert M. Chu of Nashua NH (US)
- James P. Mazza of Saratoga Springs NY (US)
- Takashi Ando of Eastchester NY (US)
- David Wolpert of Poughkeepsie NY (US)
- Chih-Chao Yang of Glenmont NY (US)
- Tao Li of Slingerlands NY (US)
- Dan Moy of Bethel CT (US)
- JENS HAETTY of Halfmoon NY (US)
- Christopher Murphy of Red Hook NY (US)
- Huai Huang of Clifton Park NY (US)
- Hosadurga Shobha of Niskayuna NY (US)
- Atharv Jog of Albany NY (US)
- Shahrukh Khan of Sandy Hook CT (US)
- Biswanath Senapati of Mechanicville NY (US)
- Utkarsh Bajpai of Delmar NY (US)
- Tenko Yamashita of Schenectady NY (US)
- John Christopher Arnold of North Chatham NY (US)
- Chen Zhang of Santa Clara CA (US)
- Terence B. Hook of Jericho Center VT (US)
- Junli Wang of Slingerlands NY (US)
- Nicholas Anthony Lanzillo of Wynantskill NY (US)
- Inventors
- Inventors filing patents with International Business Machines Corporation
- Inventors filing patents with INTERNATIONAL BUSINESS MACHINES CORPORATION