STACKED DEVICES WITH BACKSIDE CONTACTS

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Brent A. Anderson of Jericho VT (US)

Ruilong Xie of Niskayuna NY (US)

Albert M. Chu of Nashua NH (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Reinaldo Vega of Mahopac NY (US)

STACKED DEVICES WITH BACKSIDE CONTACTS

This abstract first appeared for US patent application 18337318 titled 'STACKED DEVICES WITH BACKSIDE CONTACTS

Original Abstract Submitted

A semiconductor structure includes a stacked device structure containing a first device and a second device over the first device in a stacked configuration. The semiconductor structure further includes a first backside contact connected to the first device and a first backside power line. The semiconductor structure further includes a second backside contact connected to the second device and a second backside power line.