VIA STRUCTURE WITHOUT LINER INTERFACE

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Brent A. Anderson of Jericho VT (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Ruilong Xie of Niskayuna NY (US)

Christopher J. Penny of Saratoga Springs NY (US)

Kisik Choi of Watervilet NY (US)

John Christopher Amold of North Chatham NY (US)

VIA STRUCTURE WITHOUT LINER INTERFACE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18093713 titled 'VIA STRUCTURE WITHOUT LINER INTERFACE

The abstract describes an interconnect structure involving multiple metal layers and vias within a dielectric layer.

The interconnect structure includes a first metal via on a first metal line in a metallization layer.
A first liner layer is placed on the dielectric layer.
A second metallization layer contains a first metal line on the first liner layer and the first metal via.

Potential Applications: - This technology can be used in semiconductor manufacturing for creating complex interconnect structures in integrated circuits.

Problems Solved: - Provides a solution for creating efficient and reliable interconnects in semiconductor devices.

Benefits: - Improved performance and reliability of integrated circuits. - Enhanced signal transmission capabilities. - Higher density of interconnects leading to more compact designs.

Commercial Applications: - This technology can be utilized in the production of advanced microprocessors, memory chips, and other semiconductor devices.

Questions about Interconnect Structure: 1. How does this interconnect structure improve the overall performance of integrated circuits?

  - The interconnect structure enhances signal transmission and allows for higher density interconnects, leading to improved efficiency and reliability of the integrated circuits.

2. What are the key differences between this interconnect structure and traditional interconnect designs?

  - This interconnect structure involves multiple metal layers and vias within a dielectric layer, providing a more advanced and efficient solution compared to traditional designs.

Original Abstract Submitted

An interconnect structure includes a first metal via disposed on a first metal line of a first metallization layer disposed in a dielectric layer, a first liner layer disposed on the dielectric layer, and a second metallization layer containing a first metal line disposed on the first liner layer and the first metal via.