TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Koichi Motoyama of Clifton Park NY (US)

Ruilong Xie of Niskayuna NY (US)

TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

This abstract first appeared for US patent application 18211283 titled 'TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

Original Abstract Submitted

A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes a subtractively formed via located on top of a lower level metal line. The subtractively formed via has a bottom portion and a top portion. The semiconductor interconnect structure further includes a selectively grown region formed onto the top portion of the subtractively formed via. A portion of the selectively grown region overhangs the bottom portion of the subtractively formed via in one or more directions.