Category:Jeremy Ecton of Gilbert AZ US
Jeremy Ecton
Jeremy Ecton from Gilbert AZ US has applied for patents in technology areas such as H01L23/15, H01L23/498, H01L23/522 with intel corporation.
Patents
Pages in category "Jeremy Ecton of Gilbert AZ US"
The following 49 pages are in this category, out of 49 total.
1
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18375209. DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18470645. MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (Intel Corporation)
- 18470668. MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS (Intel Corporation)
- 18473479. INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS (Intel Corporation)
- 18475326. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH (Intel Corporation)
- 18475373. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH (Intel Corporation)
- 18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION)
- 18478250. ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS (INTEL CORPORATION)
- 18503459. INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS (Intel Corporation)
- 18503489. INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS (Intel Corporation)
- 18977572. GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS (Intel Corporation)
- 18984426. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984438. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984444. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984454. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18985540. MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (Intel Corporation)
2
- 20250183182. Microelectronic Assemblie (Unknown Organization)
- 20250218880. Microelectronic Assemblies W (Intel)
- 20250218905. Component Coupled Condu (Intel)
- 20250218926. Microelectronic Assemblies I (Intel)
- 20250218955. Microelectronic Structures I (Intel)
- 20250218961. Methods Apparatus Fac (Intel)
- 20250218963. Die Conductive Vias Embe (Intel)
- 20250218983. Microelectronic Structures I (Intel)
- 20250219028. Deep Trench Capacitors Mu (Intel)
I
- Intel corporation (20250006570). GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Intel corporation (20250022786). METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Intel corporation (20250096053). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Intel corporation (20250096143). MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS
- Intel corporation (20250105074). GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS
- Intel corporation (20250105156). INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS
- Intel corporation (20250105209). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH
- Intel corporation (20250105222). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112100). DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112165). ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
- Intel corporation (20250112175). MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Intel corporation (20250120102). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125201). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125202). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125307). MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS
- Intel corporation (20250126814). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250149421). INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS
- Intel corporation (20250149455). INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS