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Category:H01L23/49
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This category has the following 29 subcategories, out of 29 total.
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Pages in category "H01L23/49"
The following 63 pages are in this category, out of 63 total.
1
- 18051141. CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18090140. SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract (Intel Corporation)
- 18178531. MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)
- 18333711. INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN (Intel Corporation)
- 18334188. PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES (Intel Corporation)
- 18359096. SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18502966. SOLDER PREFORMS WITH EMBEDDED BEADS TO ACT AS STANDOFFS (Dell Products L.P.)
- 18675750. MANUFACTURING METHOD OF AN ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18692588. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18734627. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18746188. DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18754549. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 18754738. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18762040. SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY (Samsung Electronics Co., Ltd.)
- 18770168. ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED MODULE (Samsung Electronics Co., Ltd.)
- 18775260. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18780730. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18816698. DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELECTRONIC DEVICES (TEXAS INSTRUMENTS INCORPORATED)
- 18836264. SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT WITH AT LEAST ONE CONNECTION ELEMENT (Siemens Aktiengesellschaft)
- 18891191. WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18977556. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 19011229. Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry (Micron Technology, Inc.)
- 19013180. Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor Pillars (Micron Technology, Inc.)
D
I
- Intel corporation (20240222288). SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract
- Intel corporation (20240339410). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240421042). INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN
- Intel corporation (20240421062). PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on October 10th, 2024
M
- Micron technology, inc. (20250142875). Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry
- Micron technology, inc. (20250151264). Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor Pillars
- Micron Technology, Inc. patent applications on May 1st, 2025
- Micron Technology, Inc. patent applications on May 8th, 2025
- Mitsubishi electric corporation (20240136309). SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240234348). SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20250132230). SEMICONDUCTOR DEVICE
- Mitsubishi Electric Corporation patent applications on April 24th, 2025
- Mitsubishi Electric Corporation patent applications on April 25th, 2024
- Mitsubishi Electric Corporation patent applications on July 11th, 2024
S
- Samsung electronics co., ltd. (20250014957). SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
- Samsung electronics co., ltd. (20250079319). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Samsung electronics co., ltd. (20250096179). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250105100). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250125226). ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED MODULE
- Samsung electronics co., ltd. (20250125321). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250140727). WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250149516). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on May 1st, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
- Sk hynix inc. (20240119996). MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract
- SK hynix Inc. patent applications on April 11th, 2024