Samsung electronics co., ltd. (20250079319). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Jeongseok Kim of Suwon-si (KR)
Jooyoung Choi of Suwon-si (KR)
Sangseok Hong of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
This abstract first appeared for US patent application 20250079319 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Original Abstract Submitted
a semiconductor package may include a first redistribution substrate, a first semiconductor chip disposed on the first redistribution substrate, a second semiconductor chip horizontally spaced apart from the first semiconductor chip, a mold layer provided on the first redistribution substrate to enclose the first and second semiconductor chips, a second redistribution substrate disposed on the mold layer, a connection member, which is provided at a side of the first and second semiconductor chips to connect the first redistribution substrate to the second redistribution substrate, and an antenna substrate attached to the second redistribution substrate using an adhesive layer. the antenna substrate may include a core portion, an antenna pattern provided on a top surface of the core portion, and a wiring pattern provided on a bottom surface of the core portion.
