Mitsubishi electric corporation (20250132230). SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250132230 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
the visibility of the inserted portions of the signal terminals after the insertion of the signal terminals into the lead frame is improved. a semiconductor device includes an insulating substrate, a semiconductor element, a main terminal frame, a signal terminal frame connected to the semiconductor element via a wire, and a sealing resin that seals a portion of the insulating substrate, the semiconductor element, a portion of the main terminal frame, and a portion of the signal terminal frame, in which the signal terminal frame includes a receiving portion in a portion exposed from the sealing resin, and the semiconductor device further comprising at least one signal terminal pin connected to the signal terminal frame via the receiving portion of the signal terminal frame so as to extend in a direction intersecting the upper surface of the insulating substrate.