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Category:CPC H01L22/26
Pages in category "CPC H01L22/26"
The following 53 pages are in this category, out of 53 total.
1
- 18077809. TWO STEP IMPLANT TO IMPROVE LINE EDGE ROUGHNESS AND LINE WIDTH ROUGHNESS simplified abstract (Applied Materials, Inc.)
- 18077812. TWO STEP IMPLANT TO CONTROL TIP-TO-TIP DISTANCE BETWEEN TRENCHES simplified abstract (Applied Materials, Inc.)
- 18210773. SYSTEMS AND METHODS FOR DETERMINING A FLUID HEIGHT AND/OR A FLUID VELOCITY ON A SPINNING SUBSTRATE (Tokyo Electron Limited)
- 18373582. SYSTEMS AND METHODS THAT USE INFRARED (IR) SPECTROSCOPY TO MONITOR PROCESS CHEMICALS UTILIZED IN A SEMICONDUCTOR PROCESS (Tokyo Electron Limited)
- 18455505. ADAPTIVE WAFER BOW MANAGEMENT (Applied Materials, Inc.)
- 18498194. Methods for measuring thickness and methods for manufacturing a device using the same simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18957378. DEPOSITION SYSTEM AND METHOD (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18965312. SUBSTRATE PROCESSING MONITORING (Applied Materials, Inc.)
A
- Applied materials, inc. (20250069959). ADAPTIVE WAFER BOW MANAGEMENT
- Applied materials, inc. (20250096045). SUBSTRATE PROCESSING MONITORING
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on February 27th, 2025
- Applied Materials, Inc. patent applications on January 30th, 2025
- Applied Materials, Inc. patent applications on March 20th, 2025
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R
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240222202). Methods for measuring thickness and methods for manufacturing a device using the same simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- SEMES CO., LTD. Patent Application Trends in 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20250087536). DEPOSITION SYSTEM AND METHOD
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240379468). PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379470). END POINT CONTROL IN ETCHING PROCESSES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379471). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062165). METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- Tokyo Electron Limited patent applications on February 6th, 2025