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Category:CPC H01L21/68785
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Pages in category "CPC H01L21/68785"
The following 54 pages are in this category, out of 54 total.
1
- 18156217. ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18380004. SUSCEPTOR ASSEMBLY THERMAL BREAK AND METHODS FOR COOLING A SUSCEPTOR ASSEMBLY (Applied Materials, Inc.)
- 18437119. SEMICONDUCTOR MANUFACTURING APPARATUS (Kabushiki Kaisha Toshiba)
- 18437119. SEMICONDUCTOR MANUFACTURING APPARATUS (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18563666. APPARATUSES FOR THERMAL MANAGEMENT OF A PEDESTAL AND CHAMBER simplified abstract (Lam Research Corporation)
- 18577928. ADSORPTION MEMBER AND METHOD FOR PRODUCING SAME simplified abstract (KYOCERA CORPORATION)
- 18583664. MODULAR SUBSTRATE SUPPORT ASSEMBLY (Applied Materials, Inc.)
- 18829452. SUBSTRATE SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME (SEMES CO., LTD.)
- 18904967. PROCESSING CHAMBER WITH RF RETURN PATH (Applied Materials, Inc.)
- 18940580. SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS (Taiwan Semiconductor Manufacturing Company, LTD.)
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- Applied materials, inc. (20250105051). MODULAR SUBSTRATE SUPPORT ASSEMBLY
- Applied materials, inc. (20250118593). PROCESSING CHAMBER WITH RF RETURN PATH
- Applied materials, inc. (20250125183). SUSCEPTOR ASSEMBLY THERMAL BREAK AND METHODS FOR COOLING A SUSCEPTOR ASSEMBLY
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 17th, 2025
- Applied Materials, Inc. patent applications on March 27th, 2025
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250079232). SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRICATION METHOD USING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- SEMES CO., LTD. Patent Application Trends in 2024
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- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240243001). ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE USING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250069944). SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- Tokyo Electron Limited patent applications on February 6th, 2025