Category:Chia-Ching Lin of Portland OR US
Chia-Ching Lin
Chia-Ching Lin from Portland OR US has applied for patents in technology areas such as H01L23/522, H01L23/528 with intel corporation.
Patents
Pages in category "Chia-Ching Lin of Portland OR US"
The following 37 pages are in this category, out of 37 total.
1
- 18370287. INTEGRATED CIRCUIT STRUCTURES WITH PATCH SPACERS (Intel Corporation)
- 18372506. INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED LOCAL LAYOUT EFFECTS (Intel Corporation)
- 18374600. TRENCH CONTACT STRUCTURE WITH ETCH-STOP LAYER (INTEL CORPORATION)
- 18374607. MULTIPLE VOLTAGE THRESHOLD INTEGRATED CIRCUIT STRUCTURE WITH LOCAL LAYOUT EFFECT TUNING (INTEL CORPORATION)
- 18375055. TRANSISTOR COMPRISING A COMPOSITE GATE DIELECTRIC STRUCTURE AND METHOD TO PROVIDE SAME (INTEL CORPORATION)
- 18375060. METHOD OF FABRICATING A 2D CHANNEL TRANSISTOR BY EMPLOYING SELECTIVE METALLIZATION TO FORM A SOURCE OR DRAIN STRUCTURE (INTEL CORPORATION)
- 18375064. INTEGRATED CIRCUIT STRUCTURES WITH INTERNAL SPACERS FOR 2D CHANNEL MATERIALS (INTEL CORPORATION)
- 18375084. INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING (INTEL CORPORATION)
- 18469810. VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING (Intel Corporation)
- 18471705. AIRGAP SPACER BETWEEN GATE ELECTRODE AND SOURCE OR DRAIN CONTACT (Intel Corporation)
- 18471710. DIELECTRIC ISOLATION BETWEEN EPITAXIAL REGIONS AND SUBFIN REGIONS (Intel Corporation)
- 18473887. CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (Intel Corporation)
- 18476248. ARCHITECTURES AND METHODS TO MODULATE CONTACT RESISTANCE IN 2D MATERIALS FOR USE IN FIELD EFFECT TRANSISTOR DEVICES (Intel Corporation)
- 18477906. BACKSIDE POWER GATING (INTEL CORPORATION)
- 18478691. TRANSITION METAL DICHALCOGENIDE MONOLAYER TRANSFER USING LOW STRAIN TRANSFER PROTECTIVE LAYER (INTEL CORPORATION)
- 18498318. INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS (Intel Corporation)
- 18498340. INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES (Intel Corporation)
I
- Intel corporation (20250006434). FERROELECTRIC CAPACITOR WITH INSULATING THIN FILM
- Intel corporation (20250006734). PERFORMANCE OPTIMIZATION OF TRANSISTORS SHARING CHANNEL STRUCTURES OF VARYING WIDTH
- Intel corporation (20250096114). VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING
- Intel corporation (20250098260). INTEGRATED CIRCUIT STRUCTURES WITH PATCH SPACERS
- Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Intel corporation (20250107147). ARCHITECTURES AND METHODS TO MODULATE CONTACT RESISTANCE IN 2D MATERIALS FOR USE IN FIELD EFFECT TRANSISTOR DEVICES
- Intel corporation (20250107156). DIELECTRIC ISOLATION BETWEEN EPITAXIAL REGIONS AND SUBFIN REGIONS
- Intel corporation (20250107175). INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED LOCAL LAYOUT EFFECTS
- Intel corporation (20250107212). AIRGAP SPACER BETWEEN GATE ELECTRODE AND SOURCE OR DRAIN CONTACT
- Intel corporation (20250112120). INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING
- Intel corporation (20250112122). BACKSIDE POWER GATING
- Intel corporation (20250113540). TRANSISTOR COMPRISING A COMPOSITE GATE DIELECTRIC STRUCTURE AND METHOD TO PROVIDE SAME
- Intel corporation (20250113547). INTEGRATED CIRCUIT STRUCTURES WITH INTERNAL SPACERS FOR 2D CHANNEL MATERIALS
- Intel corporation (20250113559). TRENCH CONTACT STRUCTURE WITH ETCH-STOP LAYER
- Intel corporation (20250113572). METHOD OF FABRICATING A 2D CHANNEL TRANSISTOR BY EMPLOYING SELECTIVE METALLIZATION TO FORM A SOURCE OR DRAIN STRUCTURE
- Intel corporation (20250113573). TRANSITION METAL DICHALCOGENIDE MONOLAYER TRANSFER USING LOW STRAIN TRANSFER PROTECTIVE LAYER
- Intel corporation (20250113595). MULTIPLE VOLTAGE THRESHOLD INTEGRATED CIRCUIT STRUCTURE WITH LOCAL LAYOUT EFFECT TUNING
- Intel corporation (20250140649). INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES
- Intel corporation (20250142948). INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS