18498340. INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES (Intel Corporation)
INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES
Organization Name
Inventor(s)
Ting-Hsiang Hung of Beaverton OR US
Chiao-Ti Huang of Portland OR US
Chia-Ching Lin of Portland OR US
Yang Zhang of Rio Rancho NM US
INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES
This abstract first appeared for US patent application 18498340 titled 'INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES
Original Abstract Submitted
An IC device may include a semiconductor structure and a backside semiconductor structure over the semiconductor structure. The semiconductor structure and backside semiconductor structure may constitute the source or drain region of a transistor. The backside semiconductor structure may be closer to the backside of a substrate of the IC device than the semiconductor structure. The backside semiconductor structure may be formed at a lower temperature than the semiconductor structure. The backside semiconductor structure may have one or more different materials from the semiconductor structure. For instance, a semiconductor material in the backside semiconductor structure may have a different crystal direction from a semiconductor material in the semiconductor structure. As another example, the backside semiconductor structure may have one or more different chemical compounds from the semiconductor structure. The backside semiconductor structure may be over a backside via that can couple the backside semiconductor structure to a backside metal layer.
- Intel Corporation
- Feng Zhang of Hillsboro OR US
- Tao Chu of Portland OR US
- Minwoo Jang of Portland OR US
- Yanbin Luo of Portland OR US
- Guowei Xu of Portland OR US
- Ting-Hsiang Hung of Beaverton OR US
- Chiao-Ti Huang of Portland OR US
- Robin Chao of Portland OR US
- Chia-Ching Lin of Portland OR US
- Yang Zhang of Rio Rancho NM US
- Kan Zhang of HILLSBORO OR US
- H01L23/48
- H01L27/092
- H01L29/06
- H01L29/778
- H01L29/786
- CPC H01L23/481