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18498318. INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS (Intel Corporation)

From WikiPatents


INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS

Organization Name

Intel Corporation

Inventor(s)

Robin Chao of Portland OR US

Chiao-Ti Huang of Portland OR US

Guowei Xu of Portland OR US

Yang Zhang of Rio Rancho NM US

Ting-Hsiang Hung of Beaverton OR US

Tao Chu of Portland OR US

Feng Zhang of Hillsboro OR US

Chia-Ching Lin of Portland OR US

Anand S. Murthy of Portland OR US

Conor P. Puls of Portland OR US

Kan Zhang of Hillsboro OR US

INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS

This abstract first appeared for US patent application 18498318 titled 'INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS

Original Abstract Submitted

An IC device with one or more transistors may also include one or more vias and jumpers for delivering power to the transistors. For instance, a via may be coupled to a power plane. A jumper may be connected to the via and an electrode of a transistor. With the via and jumper, an electrical connection is built between the power plane and the electrode. The via may be self-aligned. The IC device may include a dielectric structure at a first side of the via. A portion of the jumper may be at a second side of the via. The second side opposes the first side. The dielectric structure and the portion of the jumper may be over another dielectric structure that has a different dielectric material from the dielectric structure. The via may be insulated from another electrode of the transistor, which may be coupled to a ground plane.

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