18498318. INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS (Intel Corporation)
INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS
Organization Name
Inventor(s)
Chiao-Ti Huang of Portland OR US
Yang Zhang of Rio Rancho NM US
Ting-Hsiang Hung of Beaverton OR US
Chia-Ching Lin of Portland OR US
Anand S. Murthy of Portland OR US
Conor P. Puls of Portland OR US
INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS
This abstract first appeared for US patent application 18498318 titled 'INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS
Original Abstract Submitted
An IC device with one or more transistors may also include one or more vias and jumpers for delivering power to the transistors. For instance, a via may be coupled to a power plane. A jumper may be connected to the via and an electrode of a transistor. With the via and jumper, an electrical connection is built between the power plane and the electrode. The via may be self-aligned. The IC device may include a dielectric structure at a first side of the via. A portion of the jumper may be at a second side of the via. The second side opposes the first side. The dielectric structure and the portion of the jumper may be over another dielectric structure that has a different dielectric material from the dielectric structure. The via may be insulated from another electrode of the transistor, which may be coupled to a ground plane.
- Intel Corporation
- Robin Chao of Portland OR US
- Chiao-Ti Huang of Portland OR US
- Guowei Xu of Portland OR US
- Yang Zhang of Rio Rancho NM US
- Ting-Hsiang Hung of Beaverton OR US
- Tao Chu of Portland OR US
- Feng Zhang of Hillsboro OR US
- Chia-Ching Lin of Portland OR US
- Anand S. Murthy of Portland OR US
- Conor P. Puls of Portland OR US
- Kan Zhang of Hillsboro OR US
- H01L27/088
- H01L23/498
- H01L29/08
- H01L29/66
- H01L29/78
- CPC H10D84/834
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