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- =MATERIALS ENGINEERING FOR ANTI-COKING COATING STACKS= [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]5 KB (655 words) - 03:46, 6 June 2024
- =HIGH-K DIELECTRIC MATERIALS COMPRISING ZIRCONIUM OXIDE UTILIZED IN DISPLAY DEVICES= [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]4 KB (562 words) - 04:11, 16 April 2024
- =IMPRINT COMPOSITIONS WITH PASSIVATED NANOPARTICLES AND MATERIALS AND PROCESSES FOR MAKING THE SAME= [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]4 KB (541 words) - 04:58, 25 March 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (600 words) - 02:56, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]5 KB (778 words) - 02:56, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (582 words) - 03:46, 6 June 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (518 words) - 03:46, 6 June 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]3 KB (444 words) - 03:47, 6 June 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]3 KB (495 words) - 03:48, 6 June 2024
- '''Summary of the patent applications from Applied Materials, Inc. on October 5th, 2023''' * Applied Materials, Inc. has recently filed patents related to various technologies and method6 KB (658 words) - 01:40, 12 October 2023
- '''Summary of the patent applications from Applied Materials, Inc. on November 9th, 2023''' Applied Materials, Inc. has recently filed several patents related to semiconductor processin9 KB (1,094 words) - 03:47, 4 December 2023
- '''Summary of the patent applications from Applied Materials, Inc. on November 30th, 2023''' Applied Materials, Inc. has recently filed several patents related to various aspects of semi8 KB (935 words) - 06:38, 7 December 2023
- ==Patent applications for Applied Materials, Inc. on December 14th, 2023== ...TOR FOR HIGH-VOLTAGE SET AND RESET OPERATIONS simplified abstract (Applied Materials, Inc.)|17838718]])===43 KB (6,334 words) - 18:40, 1 January 2024
- 20240033878. MINIMIZING SUBSTRATE BOW DURING POLISHING simplified abstract (Applied Materials, Inc.)[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]5 KB (735 words) - 09:38, 1 February 2024
- '''Summary of the patent applications from Applied Materials, Inc. on March 21st, 2024''' ...ption material with photocurable compounds and ultraviolet light absorbing materials to form pixel isolation structures on LED substrates.6 KB (672 words) - 08:06, 27 March 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (621 words) - 02:55, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (548 words) - 02:57, 16 April 2024
- ==Patent applications for Applied Materials, Inc. on April 4th, 2024== ===METHOD FOR CMP TEMPERATURE CONTROL ([[Applied Materials, Inc. (18537574). METHOD FOR CMP TEMPERATURE CONTROL simplified abstract|185 KB (548 words) - 02:57, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]5 KB (634 words) - 04:11, 16 April 2024
- '''Summary of the patent applications from Applied Materials, Inc. on April 11th, 2024''' ...4F vertical dynamic random-access memory devices, high dielectric constant materials for thin film transistor structures, and bipolar electrostatic chucks for m5 KB (587 words) - 11:04, 16 April 2024
Page text matches
- ...areas, conductive materials, metal materials, nitride materials, and oxide materials. The apparatus also features a curved surface formed on a portion of the me * Active areas with conductive and metal materials4 KB (523 words) - 08:03, 31 May 2024
- '''Summary of the patent applications from Applied Materials, Inc. on April 11th, 2024''' ...4F vertical dynamic random-access memory devices, high dielectric constant materials for thin film transistor structures, and bipolar electrostatic chucks for m5 KB (587 words) - 11:04, 16 April 2024
- '''Summary of the patent applications from Applied Materials, Inc. on May 30th, 2024''' Applied Materials, Inc. has recently filed patents related to various methods and technologie6 KB (671 words) - 03:48, 6 June 2024
- ==Patent applications for Applied Materials, Inc. on April 4th, 2024== ===METHOD FOR CMP TEMPERATURE CONTROL ([[Applied Materials, Inc. (18537574). METHOD FOR CMP TEMPERATURE CONTROL simplified abstract|185 KB (548 words) - 02:57, 16 April 2024
- ...es with a doped dielectric material, alternating conductive and dielectric materials, and pillars extending through the layers. * Tiers of alternating conductive and dielectric materials adjacent to the doped dielectric material4 KB (490 words) - 01:39, 24 May 2024
- '''Summary of the patent applications from Applied Materials, Inc. on March 21st, 2024''' ...ption material with photocurable compounds and ultraviolet light absorbing materials to form pixel isolation structures on LED substrates.6 KB (672 words) - 08:06, 27 March 2024
- ...ith multiple memory cells, with sleeves of memory materials and conductive materials around each core. * Sleeves of memory materials and conductive materials around each silicon core4 KB (587 words) - 04:17, 26 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (597 words) - 05:00, 25 March 2024
- ...microelectronic device with alternating tiers of dielectric and conductive materials, pillars extending through the tiers, and a doped dielectric material with ...oelectronic device includes tiers of alternating dielectric and conductive materials.3 KB (410 words) - 04:17, 26 April 2024
- ...eating an over-sculpted storage node by forming an opening in a pattern of materials, etching to over-sculpt the opening, depositing storage node material, and * Opening formed in a pattern of materials3 KB (497 words) - 05:50, 18 March 2024
- =SILICON-AND-CARBON-CONTAINING MATERIALS WITH LOW DIELECTRIC CONSTANTS= [[Applied Materials, Inc.]]2 KB (256 words) - 14:57, 11 November 2023
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]2 KB (276 words) - 10:26, 4 December 2023
- '''Summary of the patent applications from Applied Materials, Inc. on November 30th, 2023''' Applied Materials, Inc. has recently filed several patents related to various aspects of semi8 KB (935 words) - 06:38, 7 December 2023
- =PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND ==PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND2 KB (330 words) - 05:06, 4 March 2024
- This technology could be applied in: One possible prior art could be the use of shock-absorbing materials in electronic devices to reduce vibrations and enhance stability.2 KB (364 words) - 08:34, 24 May 2024
- ...mprising these materials. Methods for preparing pre-lithiated anode active materials are also disclosed. * Pre-lithiated anode active materials are used in lithium-ion electrochemical cells.4 KB (489 words) - 06:46, 10 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]2 KB (336 words) - 10:26, 4 December 2023
- * Tiers consist of alternating conductive and dielectric materials adjacent to the doped dielectric material. This technology could be applied in:4 KB (498 words) - 07:47, 24 May 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]3 KB (468 words) - 04:04, 30 May 2024
- The technology can be applied in: === What materials are used in constructing the lower frame of the first treating apparatus? =3 KB (391 words) - 06:42, 8 May 2024