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Category:Srinivas Pietambaram of Chandler AZ (US)
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Pages in category "Srinivas Pietambaram of Chandler AZ (US)"
The following 20 pages are in this category, out of 20 total.
1
- 17847652. STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)
- 17957341. DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957359. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation)
- 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)
- 17958012. AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract (Intel Corporation)
- 18397915. HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract (Intel Corporation)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
I
- Intel corporation (20240111090). DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract
- Intel corporation (20240112971). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240113005). HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract
- Intel corporation (20240113007). AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract
- Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240128205). HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract
