Intel corporation (20240113005). HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract
Contents
- 1 HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES
Organization Name
Inventor(s)
Jeremy Ecton of Gilbert AZ (US)
Aleksandar Aleksov of Chandler AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
Brandon Marin of Gilbert AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Xavier Brun of Hillsboro OR (US)
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113005 titled 'HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES
Simplified Explanation
The abstract describes a microelectronic integrated circuit package structure that includes a first substrate connected to a second substrate through a conductive interconnect structure, with a dielectric material adjacent to the interconnect structure. There is a cavity in the first substrate near the interconnect structure, and a portion of the dielectric material is within the cavity.
- Explanation:
- Microelectronic integrated circuit package structure - First substrate connected to second substrate via conductive interconnect structure - Dielectric material adjacent to interconnect structure - Cavity in first substrate near interconnect structure - Portion of dielectric material within the cavity
Potential Applications
This technology could be used in: - Advanced electronic devices - High-performance computing systems - Aerospace and defense applications
Problems Solved
- Improved thermal management - Enhanced electrical performance - Increased reliability of integrated circuits
Benefits
- Higher efficiency in electronic devices - Better signal transmission - Longer lifespan of integrated circuits
Potential Commercial Applications
Title: "Innovative Microelectronic Integrated Circuit Package Structures for Enhanced Performance" - Consumer electronics - Telecommunications industry - Automotive sector
Possible Prior Art
There may be prior art related to: - Microelectronic packaging techniques - Dielectric materials in electronic devices
Unanswered Questions
Question 1:
What specific materials are used in the conductive interconnect structure?
Answer:
The abstract does not provide details on the specific materials used in the conductive interconnect structure.
Question 2:
How does the presence of the cavity in the first substrate impact the overall performance of the integrated circuit package structure?
Answer:
The abstract does not elaborate on the specific effects of the cavity on the performance of the integrated circuit package structure.
Original Abstract Submitted
microelectronic integrated circuit package structures include a first substrate coupled to a second substrate by a conductive interconnect structure and a dielectric material adjacent to the conductive interconnect structure. a cavity in a surface of the first substrate is adjacent to the conductive interconnect structure. a portion of the dielectric material is within the cavity.
