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Category:G11C5/02
Subcategories
This category has the following 19 subcategories, out of 19 total.
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Pages in category "G11C5/02"
The following 75 pages are in this category, out of 75 total.
1
- 17460324. MEMORY ARRAY, INTEGRATED CIRCUIT INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17821645. STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY ARRAYS simplified abstract (Micron Technology, Inc.)
- 17830145. MEMORY CELL CAPACITOR STRUCTURES FOR THREE-DIMENSIONAL MEMORY ARRAYS simplified abstract (Micron Technology, Inc.)
- 17893681. STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY ARRAYS simplified abstract (Micron Technology, Inc.)
- 18163146. MEMORY CIRCUIT ARCHITECTURE simplified abstract (QUALCOMM Incorporated)
- 18388461. TECHNOLOGIES FOR DYNAMICALLY MANAGING RESOURCES IN DISAGGREGATED ACCELERATORS simplified abstract (Intel Corporation)
- 18402172. Write Driver Boost Circuit for Memory Cells simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18428836. METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18431676. METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18452695. SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18504905. MEMORY DEVICE HAVING SUPPORT STRUCTURE (SK hynix Inc.)
- 18507127. FLASH MEMORY STRUCTURE (UNITED MICROELECTRONICS CORP.)
- 18513430. MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18515649. Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract (Apple Inc.)
- 18602174. MRAM CELL AND MRAM simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18733450. PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18745042. MEMORY SYSTEM AND DATA PROCESSING SYSTEM INCLUDING THE SAME simplified abstract (SK hynix Inc.)
- 18746052. STACKED SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18811059. INTERCONNECTIONS FOR 3D MEMORY (Micron Technology, Inc.)
- 18813670. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18818251. MEMORY DEVICES AND RELATED METHODS (Lodestar Licensing Group LLC)
- 18919142. STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY ARRAYS (MICRON TECHNOLOGY, INC.)
- 18953248. THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY (Kioxia Corporation)
- 18961097. APPARATUSES AND METHODS FOR OPERATIONS IN A SELF-REFRESH STATE (Lodestar Licensing Group LLC)
- 18964178. SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY CELL STRUCTURE (Kioxia Corporation)
- 18966674. MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES AND ADDITIONAL SLOT STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS (Micron Technology, Inc.)
- 18969510. MEMORY DEVICES INCLUDING PAD STRUCTURES (Micron Technology, Inc.)
- 19007072. METHOD FOR FORMING SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 19011268. Memory Arrays Comprising Vertically-Alternating Tiers of Insulative Material and Memory Cells and Methods of Forming a Memory Array (Micron Technology, Inc.)
A
- Apple inc. (20240161804). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories simplified abstract
- Apple inc. (20250157520). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories
- Apple inc. (20250157521). Memory System Having Combined High Density, Low Bandwidth and Low Density, High Bandwidth Memories
- Apple Inc. patent applications on May 16th, 2024
I
- Intel corporation (20240107749). ARRANGEMENTS FOR MEMORY WITH ONE ACCESS TRANSISTOR FOR MULTIPLE CAPACITORS simplified abstract
- Intel corporation (20240113954). TECHNOLOGIES FOR DYNAMICALLY MANAGING RESOURCES IN DISAGGREGATED ACCELERATORS simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on March 28th, 2024
K
M
- Micron technology, inc. (20240177743). METHODS FOR OPTIMIZING SEMICONDUCTOR DEVICE PLACEMENT ON A SUBSTRATE FOR IMPROVED PERFORMANCE, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
- Micron technology, inc. (20240196606). MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS simplified abstract
- Micron technology, inc. (20250087249). INTERCONNECTIONS FOR 3D MEMORY
- Micron technology, inc. (20250098158). MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES AND ADDITIONAL SLOT STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS
- Micron technology, inc. (20250098159). MEMORY DEVICES INCLUDING PAD STRUCTURES
- Micron technology, inc. (20250118341). STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY ARRAYS
- Micron technology, inc. (20250140298). Memory Arrays Comprising Vertically-Alternating Tiers of Insulative Material and Memory Cells and Methods of Forming a Memory Array
- MICRON TECHNOLOGY, INC. patent applications on April 10th, 2025
- Micron Technology, Inc. patent applications on February 20th, 2025
- Micron Technology, Inc. patent applications on February 29th, 2024
- Micron Technology, Inc. patent applications on February 6th, 2025
- Micron Technology, Inc. patent applications on January 30th, 2025
- Micron Technology, Inc. patent applications on June 13th, 2024
- Micron Technology, Inc. patent applications on March 13th, 2025
- Micron Technology, Inc. patent applications on March 20th, 2025
- Micron Technology, Inc. patent applications on May 1st, 2025
- Micron Technology, Inc. patent applications on May 30th, 2024
S
- Samsung electronics co., ltd. (20240321842). PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240414912). SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Sk hynix inc. (20240338215). MEMORY SYSTEM AND DATA PROCESSING SYSTEM INCLUDING THE SAME simplified abstract
- Sk hynix inc. (20240420738). MEMORY DEVICE HAVING SUPPORT STRUCTURE
- SK hynix Inc. patent applications on December 19th, 2024
- SK hynix Inc. patent applications on October 10th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240185911). Sub-Word Line Driver Placement For Memory Device simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240224813). MRAM CELL AND MRAM simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240135983). Write Driver Boost Circuit for Memory Cells simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250140295). METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025