Micron technology, inc. (20250087249). INTERCONNECTIONS FOR 3D MEMORY

INTERCONNECTIONS FOR 3D MEMORY

Organization Name

micron technology, inc.

Inventor(s)

Toru Tanzawa of Tokyo (JP)

INTERCONNECTIONS FOR 3D MEMORY

This abstract first appeared for US patent application 20250087249 titled 'INTERCONNECTIONS FOR 3D MEMORY

Original Abstract Submitted

apparatuses and methods for interconnections for 3d memory are provided. one example apparatus can include a stack of materials including a plurality of pairs of materials, each pair of materials including a conductive line formed over an insulation material. the stack of materials has a stair step structure formed at one edge extending in a first direction. each stair step includes one of the pairs of materials. a first interconnection is coupled to the conductive line of a stair step, the first interconnection extending in a second direction substantially perpendicular to a first surface of the stair step.