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Category:CPC H01L27/088
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Pages in category "CPC H01L27/088"
The following 117 pages are in this category, out of 117 total.
1
- 18064362. MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW simplified abstract (Intel Corporation)
- 18067968. STACKED TRANSISTORS WITH STEPPED CONTACTS simplified abstract (International Business Machines Corporation)
- 18081795. STACKED VERTICAL-TRANSPORT FIELD EFFECT TRANSISTORS (VTFETs) simplified abstract (International Business Machines Corporation)
- 18121731. INTEGRATED CIRCUIT STRUCTURES HAVING SELF-ALIGNED UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG FOR TUB GATES simplified abstract (Intel Corporation)
- 18125447. GATE LINK ACROSS GATE CUT IN SEMICONDUCTOR DEVICES simplified abstract (Intel Corporation)
- 18178406. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18209971. INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT REVEAL UNIFORMITY (Intel Corporation)
- 18300421. SELF-ALIGNED CONTACT WITH CT CUT AFTER RMG simplified abstract (International Business Machines Corporation)
- 18342090. STACKED TRANSISTORS WITH DIELECTRIC INSULATOR LAYERS (International Business Machines Corporation)
- 18346272. SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18429611. INTEGRATED CIRCUIT DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 18441082. RECESSED GATE FOR AN MV DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18443362. Common source transistor apparatus simplified abstract (Realtek Semiconductor Corp.)
- 18488412. INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18499117. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18538369. INTEGRATED CIRCUIT DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 18603591. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18617422. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18643981. MEMORY DEVICE, SEMICONDUCTOR DIE, AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668911. GATE ISOLATION FOR MULTIGATE DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18736793. SEMICONDUCTOR DEVICE WITH ACTIVE PATTERN INCLUDING A TRANSITION PATTERN AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18748200. INTEGRATED CIRCUIT STRUCTURE WITH A REDUCED AMOUNT OF DEFECTS AND METHODS FOR FABRICATING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18820481. SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECTRONIC DEVICE (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
- 18939579. DUMMY DEVICE FOR CORE DEVICE TO OPERATE IN A SAFE OPERATING AREA AND METHOD FOR MANUFACTURING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
I
- Illumina, Inc. Patent Application Trends in 2025
- IMEC VZW Patent Application Trends in 2024
- Intel corporation (20240194672). MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW simplified abstract
- Intel corporation (20240312986). INTEGRATED CIRCUIT STRUCTURES HAVING SELF-ALIGNED UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG FOR TUB GATES simplified abstract
- Intel corporation (20240321872). GATE LINK ACROSS GATE CUT IN SEMICONDUCTOR DEVICES simplified abstract
- Intel corporation (20240332290). TRANSISTOR WITH CHANNEL-SYMMETRIC GATE simplified abstract
- Intel corporation (20240421153). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT REVEAL UNIFORMITY
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on June 13th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- Intel Corporation patent applications on September 19th, 2024
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20240203984). STACKED TRANSISTORS WITH STEPPED CONTACTS simplified abstract
- International business machines corporation (20240203985). STACKED VERTICAL-TRANSPORT FIELD EFFECT TRANSISTORS (VTFETs) simplified abstract
- International business machines corporation (20240347533). SELF-ALIGNED CONTACT WITH CT CUT AFTER RMG simplified abstract
- International business machines corporation (20250006730). STACKED TRANSISTORS WITH DIELECTRIC INSULATOR LAYERS
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on January 2nd, 2025
- International Business Machines Corporation patent applications on June 20th, 2024
- International Business Machines Corporation patent applications on October 17th, 2024
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240243125). INTEGRATED CIRCUIT DEVICES simplified abstract
- Samsung electronics co., ltd. (20240321873). INTEGRATED CIRCUIT DEVICES simplified abstract
- Samsung electronics co., ltd. (20240321874). INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240321875). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240321876). SEMICONDUCTOR DEVICE WITH ACTIVE PATTERN INCLUDING A TRANSITION PATTERN AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240421154). INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. Patent Application Trends in 2025
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2024
- STMicroelectronics International N.V. Patent Application Trends in 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240312987). GATE ISOLATION FOR MULTIGATE DEVICE simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 30th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240243126). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282770). MEMORY DEVICE, SEMICONDUCTOR DIE, AND METHOD OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297170). SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339449). INTEGRATED CIRCUIT STRUCTURE WITH A REDUCED AMOUNT OF DEFECTS AND METHODS FOR FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379663). LEAKAGE REDUCTION BY HALO-IMP TECHNOLOGY IN MESA REGION OF NANO SHEET DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379664). CHECKERBOARD DUMMY DESIGN FOR EPITAXIAL OPEN RATIO simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379666). METHODS OF FORMING AN INSULATING FEATURE IN SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379668). HYBRID SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379669). Epitaxial Source/Drain Structures for Multigate Devices and Methods of Fabricating Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413149). INTEGRATED CIRCUIT
- Taiwan semiconductor manufacturing company, ltd. (20250015079). SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 9th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Texas Instruments Incorporated patent applications on February 6th, 2025
