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Category:CPC H01L23/42
Pages in category "CPC H01L23/42"
The following 63 pages are in this category, out of 63 total.
1
- 18085284. PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT simplified abstract (QUALCOMM Incorporated)
- 18403936. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18404431. DIE STRUCTURES AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18499230. PACKAGE STRUCTURE (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18542764. DIE PACKAGE STRUCTURE, METHOD FOR FABRICATING SAME, AND PACKAGE SYSTEM simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18570145. POWER SEMICONDUCTOR DEVICE simplified abstract (Hitachi Astemo, Ltd.)
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18647287. SEMICONDUCTOR DEVICE AND POWER CONVERTER simplified abstract (FUJI ELECTRIC CO., LTD.)
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- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- Amkor Technology Singapore Holding Pte. Ltd. Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
- Apple Inc. patent applications on February 6th, 2025
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240421034). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250062186). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250087555). DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240234244). ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413052). Heat Dissipation Structures
- Taiwan semiconductor manufacturing company, ltd. (20250006587). SEMICONDUCTOR PACKAGE AND METHOD
- Taiwan semiconductor manufacturing company, ltd. (20250140643). PACKAGE STRUCTURE
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on January 2nd, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025