Heat Dissipation Structures

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Po-Hsiang Huang of Tainan City (TW)

Chin-Chou Liu of Jhubi City (TW)

Chin-Her Chien of Chung-Li City (TW)

Fong-yuan Chang of Hsinchu (TW)

Hui Yu Lee of Hsinchu City (TW)

Heat Dissipation Structures

This abstract first appeared for US patent application 20240413052 titled 'Heat Dissipation Structures

Original Abstract Submitted

the present disclosure describes heat dissipating structures that can be formed either in functional or non-functional areas of three-dimensional system on integrated chip structures. in some embodiments, the heat dissipating structures maintain an average operating temperature of memory dies or chips below about 90� c. for example, a structure includes a stack with chip layers, where each chip layer includes one or more chips and an edge portion. the structure further includes a thermal interface material disposed on the edge portion of each chip layer, a thermal interface material layer disposed over a top chip layer of the stack, and a heat sink over the thermal interface material layer.